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Amkor Technology is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. Amkor offers more than 850+ different IC package formats and sizes, from traditional leadframe packages for through-hole and surface mounting, all the way to the latest chip scale (CSP) and ball grid array (BGA) solutions.  The following is a complete list of our semiconductor packaging solutions in alphabetical order.

3D & Stacked-Die Packaging Technology Solutions
Amkor Technology's commitment to provide high volume, low cost 3D packaging has led to the production of smaller, thinner packages.
3D - Through Silicon Via (TSV) Wafer Finishing & Flip Chip Stacking Solutions
Through Silicon Via (TSV) interconnects are emerging to serve a wide range of 3D packaging applications and 3D IC architectures that demand higher levels of performance and silicon integration.
ChipArray® BGA (CABGA | FBGA | CVBGA | CTBGA)
Amkor’s ChipArray® packages (CABGA, CVBGA, CTBGA) are laminate based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes.
CASON® (ChipArray SON)
Amkor's ChipArray CASON packages are laminate-based products available as QFN / QFP (Quad Flat No-Lead) packages. Stacked CASON (S-CASON) available.
Ceramic / Hermetic Package Assembly
Amkor Ceramic / Hermetic packages are commonly used for applications requiring high performance and high reliability.
Chip-on-Chip (CoC) POSSUM™ Packaging Technology
Chip on Chip (CoC) POSSUM™ is a packaging technology designed to assemble two or more dies together without the need for TSV (Through Silicon Vias).
ExposedPad LQFP / TQFP
This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages.
ExposedPad TSSOP | MSOP | SOIC | SSOP
ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch.
Flip Chip BGA (fcBGA)
Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates. Utilizing multiple high density routing layers, laser drilled blind, buried, and stacked vias, and ultra fine line/space metallization, fcBGA substrates have the highest routing density available.
fcCSP (Flip Chip CSP)
Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect.
FCmBGA (Flip Chip Molded Ball Grid Array)
Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost.
Fine Pitch Copper Pillar Flip Chip
Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications where some combination of fine pitch, ROHS / Green compliance, low cost and electromigration performance are required.
Flip Chip Packaging Technology Solutions
Since being the first OSAT to provide FCiP solutions in 1999, Amkor has continued to introduce innovative packaging solutions utilizing Flip Chip interconnect, and offers the broadest range of FCiP solutions on the market. SuperFC®, FCBGA, FCmBGA, FlipStack CSP, fcLBGA, fcLGA and fcCSP are qualified and are in production.
FlipStack® CSP
The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost.
FusionQuad® (VQFP / HVF-PQFP)
Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad QFP and MLF® technologies. FusionQuad® is based upon the addition of exposed bottom lands within a standard VQFP package format.
LQFP (Low Profile QFP)
Amkor offers a broad line of LQFP (QFP) IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness.
MEMS & Sensors Packaging Technology Solutions
Amkor Technology is the world's leader in MEMS & Sensors Technology and the world's largest outsource provider of Micro-Electronic Machines (MEMS).
MicroLeadFrame® (MLF | QFN | VQFN | LFCSP | DFN | LPCC)
Amkor's MicroLeadFrame® (MLF | MLP | LFCSP | VQFN | QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB.
MQFP (Metric QFP Package)
Amkor’s MQFP (Metric QFP) package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material and processes to assure successful, reliable performance of your IC chips. Having a complete line of MQFPs available and at your disposal means security, convenience and success.
MQFP PowerQuad 4
Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to solve these thermal problems.
PBGA (Plastic Ball Grid Array)
Amkor's PBGAs (Plastic BGA) incorporate the most advanced assembly processes and designs for today's and tomorrow's cost / performance applications.
PDIP (Plastic Dual Inline Package) | DIP
PDIP has a proven track record and is a common choice for assembly of logic, memory, microcontrollers, and other devices for use in a wide range of applications. The straight leads with 100 mil pitch allows for easy board mounting (through-hole wave soldering) or socket insertion.
PLCC (Plastic Leaded Chip Carrier) | LCC Package
Amkor's PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. RoHs compliant, lead-free & green material sets are now our qualified standards.
PowerSOP® 3 (PSOP Package)
PSOP3 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package utilizes a thick copper heat slug to accommodate the needs of higher power devices. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.
Package on Package (PoP | PSfvBGA | PSfcCSP | TMV® PoP)
Amkor has expanded its comprehensive PoP (Package on Package) family and aligned the roadmap across the supply chain to ensure that PoP will continue to scale with the industry's miniaturization, higher density and performance enhancement requirements.
SOIC Package (Small Outline IC)
SOIC is a leadframe based, plastic encapsulated package is an industry standard package and runs in very high volume, provides value added and is a low cost solution for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.
SOT-23 (Standard Outline Transistor) | SC-70 (Single Chip) | TSOT (Thin Small Outline Transister)
SOT23, TSOT, and SC70 are leadframe based, plastic encapsulated packages that are well suited for applications requiring very small footprints. These industry standard pacakages run in very high volume and provide cost effective solutions for a wide range of applications.
SSOP & QSOP Package
SSOP & QSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with applications requiring compressed body size and tightened lead pitch. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.
Stacked CSP (SCSP)
The Stacked CSP (SCSP) family utilizes Amkor's industry leading ChipArray® manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements.
System in Package (SiP)
Amkor Technology is committed to being a leader in providing the services necessary to make our customers successful with System in Package technologies.
TQFP (Thin Quad Flat Package)
Amkor offers a broad line of TQFP IC packages. This allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.
tsCSP (Thin Substrate CSP)
Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes.
TSOP (Thin Small Outline Package)
Amkor's TSOP is a leadframe based, plastic encapsulated package that is well suited for memory products, including SRAM, FLASH, FSRAM, and EEPROMs. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards.
TSSOP | MSOP (Thin Shrink Small Outline Package)
TSSOP and MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height. These industry standard packages run in very high volume and provide a value added, low cost solution for a wide range of applications.
Wafer Level Fan-Out (WLFO)
Amkor's Wafer Level Fan-Out Package (WLFO) is a package technology designed to provide increased I/O density within a reduced footprint and profile for low density single die and multi die applications at lower costs.
Wafer Level Packaging (DSBGA | WLCSP | WCSP | WLP | CSPnl)
Amkor offers Wafer Level Chip Scale Packaging (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint.

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