Microelectromechanical Systems (MEMS) are micron-size devices that can sense or manipulate the physical world. MEMS are created using micro machining processes, similar to those used to produce integrated circuit IC) devices. This allows a two- or three-dimensional mechanical system to be created in the same small area ypical of an IC device. Because the fab process is similar to that of IC fabrication, MEMS are most typically reated on silicon wafers but can also employ other substrate types as well. Due to their size, tens of thousands f these devices can be fabricated on a single wafer.
Amkor Technology is the world's leader in microelectronic packaging technologies and the worlds largest
outsource provider of MEMS and MOEMS (Micro Optical Electronic Mechanical Systems).
MEMS Packaging Considerations
MEMS and Sensor Standard Platforms
MEMS Package Evolution
Amkor's Value Proposition
Standard Platforms = Faster Development
- Faster introduction of new products
- Lower development cost
- Dedicated MEMS team
- Constantly updating the MEMS Tookbox with investments on new equipment and materials and leveraging other core technologies like TSV, Cu Pillar
- In-house test development capability
DMA, DSC, TMA, thermo-moire, FTIR, interferometer, hardness, ARES, diffusivity, solubility and more.
Modeling and Simulation
Complete electrical and thermo-mechanical capabilities (mechanical, thermal, electrical, EMI/RFI modeling).
Package and Board Level Reliability
Amkor boasts a full offering of reliability test capabilities in multiple locations.
Amkor Presently Conducts MEMS Related Activities at the Following Strategic Manufacturing Locations
- Philippines (ATP) - Hermetic, SOIC, MicroLeadFrame (MLF), Cavity MEMS, LGA
- Taiwan (ATT) - Optical MEMS
- Korea (ATK) - R&D, Wafer Level