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Stacked CSP (SCSP) Solutions

The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray® manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements. These advanced assembly capabilities in combination with Amkor's expertise in design and test, enable stacks up to 16 active devices without sacrificing yield or mounted height requirements. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations. Amkor has established industry leadership in stacking pure memory, mixed signal, and logic + memory devices.



A TSSOP / MSOP (Micro Small Outline Package) and VSSOP (Very-thin Shrink Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1mm mounted height. These industry standard packages run in mid to high volume and provide a value added, low cost solution for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at low cost.

Test Solutions for MEMS & Sensors

Amkor has long been engaged in testing across multiple generations of a wide range of MEMS sensors. Amkor is experienced and well positioned to address today’s sensor test challenges and future devices. We offer a wide range of testers, handling equipment, product / test engineering support, test development and close partnerships with leading equipment makers. In 2011, Amkor tested over 200 million units of sensors.

Data Sheets