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10 Years In Fan-in WLP Production and Still Growing

Amkor's Dr. Choon Heung Lee, EVP for WW Manufacturing and President of Amkor Korea was recently interviewed by Yole Développement about fan-in WLP. Amkor is one of the leading fan-in WLP manufacturers today. The fan-in WLP market is forecasted to grow to $8B by 2020, while current demand is outweighing capacity. Read the interview in the latest issue of i-Micronews https://lnkd.in/eRa_-cz

 


Flip Chip Packaging Solutions

Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. fcCSP, FCBGA and FlipStack CSP are qualified and are in production.

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