Amkor Technology offers the fcCSP package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect. Current wafer bump technology and flip chip assembly process allows for peripheral flip chip bumping or area array bumping, with either solder or Copper Pillar (CuP) Bump Technology. The fcCSP is also available in LGA format, allowing for a lower minimum package thickness.
Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. We also offer a Flip Chip MLF® and Dual Row MLF® package.
Wafer Level Packaging Solutions
Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping, wafer level test, back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as fcCSP & SiP.
|02/10/14||Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2013|
|02/04/14||Amkor Technology to Announce Fourth Quarter and Full Year Financial Results on February 10, 2014|
|01/15/14||Amkor Technology Appoints Giel Rutten as Executive Vice President, Advanced Products|
|12/10/13||Amkor Technology Appoints Dr. Choon Heung Lee as Chief Technology Officer|
|"Enhancing Overall System Functionality and Performance with the Right Packaging Solutions", White Paper