Amkor Technology offers the fcCSP package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect. Current wafer bump technology and flip chip assembly process allows for peripheral flip chip bumping or area array bumping, with either solder or Copper Pillar (CuP) Bump Technology. The fcCSP is also available in LGA format, allowing for a lower minimum package thickness.
The SCSP family leverages Amkor's industry leading ChipArray® manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements. These advanced assembly capabilities in combination with Amkor's expertise in design & test, enable stacks up to 16 active devices without sacrificing yield or mounted height requirements. Amkor has established industry leadership in stacking pure memory, mixed signal, & logic + memory devices.
Amkor MEMS & Sensor Packaging Solutions
Amkor is the world's leader in microelectronic packaging technologies and the worlds largest outsource provider of MEMS and Sensors. Amkor is the world's leading service provider in MEMS packaging technology and offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications.
|07/21/14||Amkor Technology to Announce Second Quarter 2014 Financial Results on July 28, 2014|
|05/27/14||Amkor Technology and Carsem Jointly Announce Settlement|
|05/07/14||Amkor Technology to Present at Barclays High Yield Bond and Syndicated Loan Conference|
|05/02/14||Amkor Technology Announces Presentation Time Change at Jefferies TMT Conference|
|Amkor Article in CSR June Issue, "Enabling a Multiple Processor SiP with 2.5D TSVs" Technical Article
|"Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package", White Paper
|Amkor article in China Integrated Circuit Magazine April 2014 Issue, "Trends and Considerations in Automotive Electronic Packaging" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Amkor Technology - Company Profile" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Trends for the Next Generation of PoP Package and Its Warpage Control" (Chinese)