Amkor Technology is the world's leader in MEMS packaging technologies and the world’s largest outsource provider of MEMS and Sensors. Amkor offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications. Amkor currently has MEMS & Sensor manufacturing in our Korea, Taiwan and Philippines factories.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
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|05/11/16||Amkor Technology to Present at Goldman Sachs First Annual Leveraged Finance Conference|
|05/03/16||Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies|
|04/27/16||Amkor Technology Reports Financial Results for the First Quarter 2016|
|04/20/16||Amkor Technology to Announce First Quarter 2016 Financial Results on April 27, 2016|
|Amkor Article in CSR March/April Issue, "The Internet of Things and MEMS Packaging" Technical Article