Amkor Technology will be exhibiting at the SMIC Symposium in Beijing on September 13, 2013.
As a SMIC partner with extensive portfolio of Advanced Packaging such as Copper Pilliar, TSV, TMV, Chip-on-Chip, MEMS and Flip Chip, as well as Design & Test Services. Amkor Technology is extremely well placed to fulfil the requirements of chip vendors.
If you are planning on attending this event we would welcome the opportunity to meet with you and discuss how we may be able to assist you with your future product development and services needs.
For additional information on the upcoming symposium, visit: http://service.smics.com/symposium/website/CN/en/index.jsp