Amkor Technology invites you to join us at the SemIsrael Expo 2013. The Conference is being held on Monday, November 18th at the Avenue Convention Center, located in the Airport City, Israel from 8:00AM to 15:00PM.
Amkor is a proud sponsor of this event, and is pleased to announce that we will have two presentations at the conference.
Participation is FREE but registration is required. To register for the event and get further information on the SemIsrael Expo 2013 visit: http://expo.semisrael.com/register
Information on Amkor's Test Services can be found at: http://www.amkor.com/go/test-services
Amkor Technology will be exhibiting our extensive portfolio of Advanced Packaging such as Copper Pilliar, TSV, TMV, Chip-on-Chip, MEMS and Flip Chip, as well as Design & Test Services. Amkor is extremely well placed to fulfill the requirements of all types of chip vendors.
If you are planning on attending this event we would welcome the opportunity to meet with you and discuss how we may be able to assist you with your future product development and services needs.For additional information on the upcoming expo, visit: http://expo.semisrael.com/