Amkor Technology invites you to join us at SEMICON West 2013 being held July 9-11 at the Moscone Center, San Francisco, CA. Amkor’s technical staff will be presenting at this year’s conference. The presentation at this year’s event include:
Hosted by the Advanced Packaging Committee, SEMI Americas
Tuesday, July 9, 2013
North Hall, Moscone Center
Mobile electronics, with a huge spotlight on the thriving smartphone and tablet market, are fueling growth in semiconductors today, a trend expected to escalate over the years ahead. 'Generation Mobile' relates to consumers worldwide who now rely on such products as a way of life. As demand intensifies for higher performance, greater functionality, and lower power consumption, our industry is experiencing a strong wave of innovation, inspired by those willing to push boundaries and make these increasingly sophisticated products a reality. IC packaging has firmly established itself as a crucial part of the IC and system design process. In that vein, session speakers will discuss today's IC packaging solutions, as well as, explore possibilities for future packaging technologies being poised to enable 'generation mobile' to flourish and infiltrate lifestyles around the globe.
On Tuesday, July 9, from 11:00am-11:20am - Roger St. Amand Vice President, 3D CSP will present "Generation Mobile - Application and Baseband Processors"
On Wednesday, July 10th from 1:00-3:30 PM - Ron Huemoeller, Senior Vice President, Advanced Product Development will be participating in the TechXPOT North: "Advancing 2.5D and 3D Packaging through Value Engineering" panel session.
For additional information, please visit: http://www.semiconwest.org/node/8511