Where: Taipei City, Taiwan

When: 03-Sep-2014 - 03-Sep-2014

Details:

THEME: Innovative Advanded Package Solutions in the Mobile Era

Room: 504, 5F, TWTC Nangang Exhibition Hall, Taipei

Dr. Kim Jin Young, Sr. Director R&D Amkor Technology Korea, will be presenting "Fine Pitch Flip Chip Interconnection Technology (CoC, CoW)" on Wednesday September 3rd between 13:20-13:55.

ABSTRACT:

It is obvious that there is a growing needs for advanced flip chip technology in support of next generation devices with die complexities. This increase in complexities and functionality have been driving the need to investigate fine pitch interconnection technology with System in Package(SiP) platform. Various challenges need to be also solved to support the volume production and establish reliable manufacturing process. This presentation will review fine pitch interconnection technology with various chip attach metrology such as Chip on Chip (CoC), and Chip on Wafer(CoW).

If you are planning on attending this event we would welcome the opportunity to meet with you and discuss how we may be able to assist you with your future product development and services needs. Please email us at marketing@amkor.com.



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