Amkor Technology invites you to join us at Semicon Japan 2012. The Conference is being held November 5-8.
Amkor is pleased to announce that Masayuki Ohi, Sr. Product Director, will present “Amkor's Advanced Technologies and Business Strategy”, on Wed. November 5th from 12:00 - 13:00 at the OSAT Forum. Below is the abstract of Masayuki Ohi's presentation.
"In the semiconductor industry today, Si device is more integrated with higher speed and function, so new flip chip interconnection and packages are required. TSV which s most advanced assembly technology for 3D package now is also applied for such new pplications. Amkor Introduces our own advanced technologies for such advanced area to meet customer expectation and Amkor recommended procedure for new package evelopment and selection to minimize TAT and cost"
For additional information on SEMICON Japan 2012, please visit their website at: http://www.semiconjapan.org/en/