Amkor Technology invite you to join us at the 18th PWB Expo Wednesday, January 18th through Friday, January 20th at the Tokyo Big Sight in Japan.
WonChul Do, Sr. Director - R&D Div. Group, will present “High Density Fan Out Wafer Level Packaging” on Wednesday, January 18th at 9:30AM. This presentation discusses the limitations of conventional fan-out wafer level packaging and introduces emerging high density fan-out technologies developed for use in high I/O count, multi-chip, and 3D/SiP applications. Package structure and attributes, key assembly technologies, and requirements for material and equipment are presented.
For additional information on the upcoming expo, visit: http://www.nepconjapan.jp/en/About/PWB_EXPO