Amkor Technology invites you to join us at the 10th Annual International Wafer-Level Packaging Conference & Exhibition. The Conference will be held November 5-7, with the exhibition on November 6-7, 2013 at the DoubleTree Hotel, San Jose, CA.
The 2013 conference consists of three major technical tracks with two full days of presentations on 3D Integration, MEMs Development and Wafer Level Packaging. In addition, four professional tutorials are being offered, keynote presentations by industry leaders will be given and an extensive vendor exhibition will be open.
Amkor is pleased to announce that Russell Shumway (Director, MEMS Products), will chair the MEMS Track and Curtis Zwenger (Sr. Director, Advanced Platform/Product Development), will co-chair the WLP Track. In addition, Amkor will be participating in the exhibition in booth space #17.
Further information about the event can be found at http://www.iwlpc.com/