Amkor Technology invites you to join us at the inaugural Electronic System Technologies Conference & Exhibition (ESTC) being held May 21-22 at the New Tropicana in Las Vegas. This event sponsored by the IPC-Association Connecting Electronic Industries is positioned to attract the entire electronics industry from components to board assemblies to complete systems.
Program highlights include exhibits, a technical conference consisting of specialized tracks and break-out sessions facilitated by experts in the industry, plenary sessions to focus on specific issues, professional development courses, standards development meetings, luncheons featuring dynamic speakers and evening networking receptions.
Amkor’s own Senior Vice President, Dr. Choon Lee, will deliver a Keynote Speech on Wednesday, May 22nd at 6:30 PM entitled, “System Integration Challenges In Packaging”.
Dr. Lee will discuss the convergence of rival packaging technologies and how System-on-Chip (SoC) and System-in-Package (SiP) technologies have come to a strategic inflection point. The SiP and SoC convergence has led to the evolution of micro-EMS, a module level packaging which integrates the functional aspects of both SiP and SoC. He will also reveal how SiP, SoC and micro-EMS packaging types have evolved over time as well as the strengths and weaknesses of each. Common applications and uses for each of the packaging technologies within the major market segments will also be discussed.
In addition, Amkor’s technical staff will participate as facilitators during the program, with Nozad Karim, Vice President, Electrical Engineering and Characterization chairing the System Solutions track and co-chairing the System Integration track, and Ozgur Misman, Senior Manager, Electrical Packaging and Characterization co-chairing the High Speed Circuits and Systems track.
Ozgur Misman will also be presenting a paper on Tuesday, May 21st, during the Power Distribution and Modeling track entitled “Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package”.
Amkor will also be participating in the event exhibition with our technical staff on hand for questions or discussions – please visit us at booth #604.
Further information about the event can be found at http://estc.ipc.org/html/exhibition.htm