Where: Radisson Fort McDowell Resort and Casino Scottsdale/Fountain Hills, Arizona USA Booth #20

When: 09-Mar-2009 - 12-Mar-2009

Details:

Stop by our booth to learn about our evolutionary new package - TMV™ POP (Thru-Mold Via Package on Package), Amkor's Next Generation 3D Packaging Solution or visit us at www.amkor.com

Amkor Presentations at GBC & DPC:

Monday, March 9th
Opening Remarks
8:00 AM - 9:00 AM
Lee Smith, VP of Business Development, Amkor Technology, Inc.

Session 2: 1:00 PM - 3:00 PM
3D Packaging, TSV, Roadmap, and Supply Chain/Technology Development
1:30 PM Key Requirements for 3D Packaging using TSVs and TMV Technologies
Robert Lanzone

Professional Development Courses (1/2 Day)8:00 a.m. - Noon
Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies PDCR
Course Leader: Moody Dreiza

Tuesday, March 10th
11:30 a.m. - 12:00 p.m. Flip Chip
Analysis of BGA Solder Joint Reliability for Selected Solder Alloy and Surface Finish Configurations
Ron Huemoeller, YoonHa Jung, Robert Darveaux

1:30 p.m. - 2:00 p.m. Flip Chip
The Impact of Advanced Materials on FCBGA Package Reliability and Performance Enhancement
Nokibul Islam

4:00 p.m. - 4:30 p.m. Flip Chip
Coreless Substrate Assembly & Reliability
Jon G. Aday, Steven Lee, Nokibul Islam

5:00 p.m. - 5:30 p.m. 3D Packaging
Development of High Die Count Spacerless Film based NAND Stacked Chip Scale Packages
J. B. Yu, Roger St. Amand

Wednesday, March 11th
3:00 p.m. - 3:30 p.m. Wafer Level Packaging
Amkor’s CSPnl™: Comparison of Bump on Pad and Cu Redistribution WLCSP Designs
Rex Anderson, T. Y. Tee, R. Chilukuri, H. S. NG, C. P. Koo, B. Rogers

Thursday, March 12th
9:50 a.m. - 10:20 a.m. 3D Packaging
Next Generation Package on Package (PoP) Platform with Through Mold Via (TMV) Interconnection Technology
Curtis Zwenger, JinSeong Kim, Lee Smith