On July 7th Amkor and Texas Instruments announced they teamed to deliver the "industry's first fine pitch copper pillar flip chip packages" to the market, enabling reductions in chip and package sizes at lower cost with higher performance.  TI and Amkor provided more information regarding this fine pitch FC and copper pillar platform technology at Semicon West.

This presentation will review the process development and advancement of several next generation fine pitch Cu Pillar bumping and assembly processes, with pitches less than 50um, that are focused on addressing the challenges seen on silicon nodes such as 45nm and below.  The advantages of the fine pitch Cu pillar structure will be reviewed in comparison to competing technologies. The risk assessment and rational decision making methodologies used will help illustrate the accelerated development and qualification path taken to meet an aggressive market introduction timeline for advanced device applications.  Through a structured collaborative approach to process & material development, design simulation, and reliability assessment approach, the team achieved its goal to provide a robust, reliable, and low cost bump and assembly process to meet the demands of current and future fine pitch, low-k, advanced silicon node technologies.

Bob has been in the electronics industry for over 22 years working in diverse and progressive roles in advanced packaging development, technology, manufacturing, marketing, and business development.  He has worked for Industry Leaders in their respective fields or market segments such as IBM, Kyocera, Unitive, ChipPAC and currently Amkor as the VP of Advanced Packaging Development.  His current focus is on 3D packaging integration including Fine Pitch Flip Chip, Cu Pillar,  and next generation Package on Package (PoP).