Please join the IMAPS Arizona Chapter for our first 2013 Luncheon this Thursday, January 24, 2013 at the Dobson Ranch Inn, Mesa AZ.
Wishing you all a Happy New Year!
Speaker: Curtis Zwenger, Senior Director, Package Development, Amkor Technology
Future packaging technologies now in the development to deployment phase, must address advanced system integration challenges. As advanced computing, communications and multimedia functions continue to be integrated into handheld devices; electrical and thermal performance have become as critical as form factor and mechanical performance in low cost high volume 3D or chip scale package solutions. To deliver higher performance and integration in high volume / low cost packaging solutions, new process and materials technologies are required, including widespread use of wafer level processing. System integration requirements coupled with fragile silicon nodes and advanced performance requirements place increasing challenges in new package development. This is driving increased collaboration and communication across the supply chain in developing and deploying future packaging technologies.
To ring in the new year, IMAPS wants to highlight the value of chapter membership. All members who attend this event will be entered into a drawing for membership prizes:
Grand Prize: Kindle Fire
First Prize: Free Individual Membership or dues reimbursed for 2013
2nd prize: Free individual membership renewal in 2014
3rd prize: Free luncheon registration in 2013
If you are not yet a member, join IMAPS by Jan. 22 to be included in the Grand Prize drawing.
Luncheon and presentations - $25.00 in advance / $30 at door.
Register On-line by Jan. 22.
All IMAPS members who register by end of day January 22 will receive a $5 Starbucks gift card at the door!