Where: Radisson Fort McDowell Resort & Casino Scottsdale, AZ

When: 09-Mar-2010 - 11-Mar-2010

Details:

IMAPS International Conference and Exhibition on Device Packaging
March 9-11, 2010
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, Arizona
Booth #20

Amkor is a microelectronics solutions provider with advanced technologies and track record of innovation.  Amkor was recently recognized for the 2009 global Frost & Sullivan Technology Innovation of the Year Award for its line-up of innovative new products, including Thru-Mold Via Package on Package (TMV™ PoP), FusionQuad®, and Flip Chip Molded Ball Grid Array (FCMBGA).

http://www.amkor.com/index.cfm?objectid=3876A3E5-BAE4-39D8-129BF85E6653C983

Stop by our booth or visit us at  www.amkor.com to learn how we can be a solutions provider for you.

Amkor Presentations:

Tuesday, March 9th

7:00 - 8:30 pm
3D Panel Discussion: 3D Integration Technologies, Applications and Roadmaps
Ron Huemoeller
 

Wednesday, March 10th

11:00 a.m. - 11:30 a.m.. Flip Chip
Flip Chip Bump Electromigration Reliability: A Comparison of Cu Pillar, High Pb, SnAg, and SnPb Bump
Ahmer Syed, CJ Berry, Karthikeyan Dhandapani, Lou Nicholls, Robert Darveaux

12:00 p.m. - 12:30 p.m. Flip Chip
Coreless Substrate Design, Assembly & Reliability for High Speed Applications
Jon G. Aday, Nozad Karim, Mike Devita, Steven Lee

6:00 p.m. - 7:30 p.m.
Wafer Level Packing Panel Discussion
Rex Anderson


Thursday, March 11th

8:30 a.m. - 9:00 a.m. 3D Packaging
Thru Mold Via (TMV™) Package on Package Development and Surface Mount Validation
Bob Bancod, Robert Lanzone, JS Kim, JH Yoon


8:30 a.m. - 9:00 a.m. Wafer Level Packaging
Advances in WLCSP Technologies to Enable Cost-Reduction
Rex Anderson,  Ravi Chilukuri, Boyd Rogers, Ahmer Syed

Website: http://www.imaps.org/devicepackaging/