Where: Orlando, Florida

When: 30-Sep-2013 - 03-Oct-2013

Details:

Amkor Technology invites you to join us at the IMAPS 46th International Symposium and Exhibition on Microelectronics held on September 30 - October 3, 2013 at the Rosen Centre Hotel in Orlando, Florida.

Amkor is pleased to author three papers at this year’s conference.  All papers will be presented on Tuesday, October 1st, 2013:

Corey Reichman, Staff Design Engineer at Amkor Technology, will be presenting, "Package Technology Selection of 28nm High Power FPGA with Pb-Free Bumps: Flip Chip Molded BGA Versus Traditional Bare Die Package" from 2:25pm - 2:50pm

ABSTRACT:

Selecting the optimal flip-chip package technology for the next generation 28nm FPGA is critical not only to meet reliability benchmarks for Pb-free bumps, but also in meeting the field-use environment requirements for high power devices. Component level reliability testing was conducted on three separate package types: Bare die flip chip BGA (FCBGA), flip chip molded BGA (FCMBGA) with capillary underfill, and FCMBGA with molded underfill. Testing was conducted independently at two separate facilities. Testing included moisture resistance testing (JESD22-A102D Condition Level C), temperature cycle (JESD22-A104 Condition Level B), 1000hrs bake and hybrid test combining 100 hours of unbiased hast with temperature cycling. Reliability monitoring was conducted through multiple means including electrical testing for circuit continuity, CSAM imaging at frequent read points to monitor silicon integrity and underfill adhesion performance, cross-sections for the inspection of bump crack propagation, and FIB analysis of the UBM structure after test completion. In addition to reliability testing of three flip chip BGA platforms, other usage factors were considered. These included package specific design rule flexibility and future generation packaging requirements. The results of the evaluation demonstrated that bump integrity remained strong for all three package types – showing no cracks after 1,500 temperature cycles and 1000hrs of bake. The performance of both molded flip chip packages was equivalent and each was better than the bare die. Ultimately, the FCMBGA with molded underfill was selected based on design rule flexibility for passive components as well as robustness on component test handling compared to the other two capillary underfill package options.

 

Fernando Roa, Director of Flip Chip Products at Amkor Technology, will be presenting, "Application of Molded Underfill in Packaging of SMT Modules" from 2:25pm - 2:50pm

ABSTRACT:

System in a package (SIP) solutions are widespread in all sorts of electronic appliances and, in special, for wireless communications, due their convenience of integration different functionality (and silicon) into one single ‘package’. OEMs prefer them over single point solutions because they simplify their supply chain. But if SIP has helped consolidate the supply chain it hasn’t helped process engineers ; as these systems become more complex, with integration of different ICs, switches, diodes, resistors, capacitors, coils, etc. the challenges become varied and sometimes difficult to address. In this paper, we review some of the challenges we have faced in developing a SIP MUF solution, that is, modules which use a single encapsulation process : challenges, benefits and adoption rates.

 

Bora Baloglu, Senior Engineer at Amkor Technology, will be presenting, "Warpage Characterization and Improvements for IC Packages with Coreless Substrate" from 4:55pm to 5:20pm

ABSTRACT:

Coreless package substrates are preferred for their superior electrical performance and thin profile compare to the conventional substrates with core. However, one of the major concerns with the coreless substrate packages is the warpage control. It is difficult to meet the industry standards for co-planarity needs because of the high CTE of the coreless substrates and the missing stiff core material in the stack up of the coreless structure. Finite element analysis (FEA) is utilized to investigate the use of coreless substrate in different package configurations. In this study, known stiffening structures such as a stiffener ring, one or two piece lid and molding options are investigated to characterize the advantages and disadvantages of using each of these structures to control the warpage in an IC package with coreless substrate. Available shadow moiré data is used for initial correlation of the finite element model and further design changes were carried out to stiffen the structure in the final packaged configuration. It is important to understand and make design considerations accordingly to improve assembly yield. Suggestions are made depend on the FEA findings which would guide the selection of the stiffening structure for a package with coreless substrate.


For additional information on the show, please visit: www.imaps2013.org

 

 



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