Where: Sheraton San Diego Hotel and Marina, San Diego, CA

When: 29-May-2012 - 01-Jun-2012

Details:

Visit Amkor Technology at the 62nd Electronic Components and Technology Conference (ECTC) 2012 at the Sheraton San Diego Hotel & Marina in San Diego, CA, BOOTH #611

 

Amkor will also be presenting the following papers:

"Factors Affecting Pb-free Flip chip Bump Reliability and Life Prediction", Ahmer Syed

Evaluation of Back End of Line Structures Underneath Wirebond Pads in 32nm Ultraa Low-k Device", Joon-Su Kim and Toyohiro Aoki (IBM)

"Evaluation of Raw Substrate Variation from Different Suppliers and Processes, as Well as their Impact on Package Warpage", Wei Lin (ATK)

"Evaluation and Verification of Enhanced Electrical Performance of Advanced Coreless Flip-chip BGA Package with Warpage Measurement Data", GaWon Kim (ATK)

"Development of Large Die Fine Pitch Flip Chip BGA using TCNCP Technology", Yanggyoo Jung (ATK)