Amkor Technology invites you to join us at the European 3D TSV Summit. The Conference is being held on January 22 – 23, 2013 in Grenoble France at the MINATEC.
Amkor is a pleased to announce that Ron Huemoeller, Senior VP Advanced Product Development here at Amkor will present the keynote “The Future of Packaging: Advanced System Integration” at 13:45pm on Tuesday January 22nd. Amkor will also be participating in the Panel Discussion – “3DIC: Ready for high volume manufacturing?” later in the day at 17:45pm.
Amkor will also be participating in the exhibition during the conference where you can learn more about our Test & Design services and advanced packaging technology such as TSV, Package-on-Package (PoP), Copper Pillar, WLFO, MEMS, Flip Chip and 3D Packaging.
To register for the European 3D TSV Summit and get further information, please visit: http://www.semi.org/eu/node/8206