Where: San Diego, CA USA

When: 27-May-2009 - 28-May-2009

Details:

TECTC 2009

The 59th Electronic Components and Technology Conference

Booth #207
Exhibit May 27 & 28, 2009 San Diego, California

Amkor Presentations:

Wednesday, May 27:

Session 7: Advanced Flip Chip Packaging
2:20 PM
Study of FCMBGA with Low CTE Core Substrates
Presented by MinJae Lee- Amkor Technology Korea, Incorporated

Thursday, May 28, 2009

Session 16: Flip Chip and Lead Free Processes
8:00 AM
Study of Interconnection Process for Fine Pitch Flip Chip
Presented by MinJae Lee- Amkor Technology Korea, Incorporated

Session 20: Bump Reliability and Electromigration
2:20 PM
Comparative Electromigration Performance of Pb-Free Flip Chip Joints with Varying Board Surface Condition
Presented by Lou Nicholls- Amkor Technology, Incorporated

Session 21: Emerging Flip Chip Processes
1:55 PM
Molded Underfill Development for FlipStack CSP
Presented by JoonYeob Lee- Amkor Technology, Korea

Session 33: Wafer Scale Assembly Processes
4:20 PM
Evaluation for UV Laser Dicing Process and Its Reliability for Various Designs of Stack Chip Scale Package
Presented by JoonYeob Lee- Amkor Technology, Korea
Friday, May 29, 2009

Session 27: Innovations in Reliability Characterization
8:00 AM
Field Use Environment for a FCBGA in a Laptop Computer Application
Robert Darveaux- Amkor Technology, Incorporated

Stop by our booth (#207) to learn about our new packages - TMV™ PoP, FCMBGA, and FusionQuad® or visit us at www.amkor.com

Visit the ECTC website: www.ectc.net for more information on the conference.