Amkor Technology invites you to join us at the 9th annual 3-D Architectures for Semiconductor Integration and Packaging Conference being held at Sofitel San Francisco Bay, in Redwood City, California, December 12-14.
This conference brings together technology and business leaders from around the world to take a look at the technology and market landscape for emerging 3-D device and systems integration and interconnect.
This meeting is firmly established as a leading industry event in 3-D integration and packaging and serves the needs of the entire 3-D ecosystem, providing exceptional opportunities to network with, and learn from, other senior-level technology and business leaders. The format of the conference and its presentations enables speakers to present the most up-to-date and forthright perspectives possible. The conference offers a unique opportunity to gain the latest technology and market insights on emerging and on-going 3-D integration and packaging efforts, as well as on technology and industry trends in this dynamic arena.
On Thursday December 13th, Amkor’s Sr. Vice President of Advanced Product Platform Development, Ron Huemoeller, will be presenting “TSV Package Integration: How Close Are We Really?” as part of the 3-D ICs – Are We Ready? keynote session.
In addition, Amkor will be exhibiting in the foyer area adjacent to the conference suites.
Further information can be found at http://techventure.rti.org/.