Amkor Technology is a "Platinum Sponsor" and will be exhibiting as well as presenting the following sessions:
Wednesday, November 7, 2012
Session 3 - Wafer Bonding MEMS and Hermeticity Standards
Chair: Russell Shumway, Amkor Technology
10:30am – 12:00pm, Santa Clara/San Jose
Thursday, November 8, 2012
Session 9 - Fan-Out Wafer Level Packaging Technologies
Chair: Curtis Zwenger, Amkor Technology
3:00pm – 5:00pm, Monterey/Carmel
For Conference details, visit the web site: http://www.iwlpc.com/