Tokyo big Sight, Japan
16-Jan-2013 - 18-Jan-2013
Amkor Technology invites you to join us at the 42nd InterNepcon
Japan conference. The Conference is being held on January 16-18, 2013 at
the Tokyo Big Sight, Japan.
Amkor is a pleased to announce that Glenn Rinne, VP, Head of Research and Development at Amkor will present "Package Technology Roadmap for Amkor Technology" on Wednesday January 16th.
Amkor will also be participating in the exhibition during the conference where you can learn more about our Test & Design services and advanced packaging technology such as TSV, Package-on-Package (PoP), Copper Pillar, WLFO, MEMS, Flip Chip and 3D Packaging.
To register for the 42nd InterNepcon Japan conference and get further information, please visit: http://www.nepcon.jp/en/