Amkor Technology invites you to join us at the 63rd ECTC 2013 (IEEE Electronic Components and Technology Conference) being held May 28-31 at the Cosmopolitan of Las Vegas. This premier international packaging, components, and microelectronic systems technology conference offers attendees an outstanding array of packaging technology information.
Amkor’s technical staff will be presenting five papers at this year’s conference, in addition to chairing an evening plenary panel session. We will also be participating in the Exhibit Pavilion with our technical staff on hand for questions or discussions – please visit us at booth #300.
Presentations at this year’s event include:
Wed. May 29th
Session 2: 3D Materials and Processing
am – Development of 3D Through Silicon Stack (TSS) Assembly for Wide IO Memory
to Logic Devices Integration
Dong Wook Kim, Sam Gu, Ramachandran Vidhya, Brian Henderson, Urmi Ray, and Matt Nowak – Qualcomm, Inc.
ChangMin Lee, JongSik Paek, KiWook Lee, and Ron Huemoeller – Amkor Technology, Inc.
2013 ECTC Plenary Session
7:00-9:00 pm – Packaging Challenges Across the Wireless Market Supply ChainChair: Lou Nicholls, Amkor Technology
Thurs. May 30th
Session 15: Enabling Technologies for Flip Chip Assembly
10:50 am – Ultra Large System-in-Package (SiP) Module and Novel Packaging Solution for Networking ApplicationsMudasir Ahmad, Mohan Nagar, and Weidong Xie – Cisco Systems, Inc.
Session 16: Interconnect Reliability
8:25 am – Electromigration Reliability of Various WLCSP Interconnect StructuresAhmer Syed, Karthikeyan Dhandapani, Christopher Berry, and Robert Moody – Amkor Technology, Inc.
Session 18: Thermal and Mechanical Modeling & Simulation
8:50 am – Effective Package-On-Package Warpage DOE Design with Analytical MethodShengmin Wen and Wei Lin – Amkor Technology, Inc.
Session 21: Advanced Substrate and Flip Chip Packaging
3:55 pm – Development of CoC (Chip on Chip) or FtoF (Face to Face) Technology as an Alternative Toward Low Cost 3D PackagingJemmy Sutanto, Dong Hee Kang, Sa Yun Ma, Ju Hoon Yoon, Seong Roung Kim, Kwang Seok Oh, Kwang Sun Oh, Kyung Rok Park, Robert Lanzone, and Ron Huemoeller – Amkor Technology, Inc.
Further information about the event can be found at http://www.ectc.net/.