Amkor Technology invites you to join us at the 15th IC Packaging Technology Expo 2014. The expo is being held on Wednesday, January 15th through Friday, January 17th at the Tokyo Big Sight in Japan from 10:00AM to 17:00PM.
Amkor Technology will be exhibiting our extensive portfolio of Advanced Packaging such as Copper Pilliar, TSV, TMV, Chip-on-Chip, MEMS and Flip Chip, as well as Design & Test Services. Amkor is extremely well placed to fulfill the requirements of all types of chip vendors.
If you are planning on attending this event we would welcome the opportunity to meet with you and discuss how we may be able to assist you with your future product development and services needs.
For additional information on the upcoming expo, visit: http://www.icp-expo.jp/en/Home/