Where: Scottsdale/Fountain Hills, Arizona

When: 09-Mar-2014 - 13-Mar-2014

Details:

Amkor is pleased to be a sponsor at this event and will be exhibiting. Amkor will also be Chairs and have one presentation at the conference.

  • Ron Huemoeller, Sr VP - Product Development at Amkor, will be the General Chair at this years event.
  • Russell Shumway, Director of MEMS Products at Amkor, will be co-chairing the MEMS track.
  • Bob Kuo, Director - Package Development at Amkor, will be co-chairing the Photonics & LED Packaging track.
  • Mike Kelly, Sr Director - Package Development at Amkor, will present the following: "ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)"
If you are planning on attending this event we would welcome the opportunity to meet with you and discuss how we may be able to assist you with your future product development and services needs. Please email us at marketing@amkor.com.


For additional information on the upcoming expo, visit: http://www.imaps.org/devicepackaging/



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