Amkor’s Process Integration experts are focused on alignment of semiconductor packaging design processes.
Customer requirements and processes are maintained by establishing standard operating procedures (SOP). A Customer may have several SOPs that support various package types.
Customer Design SOPs are integrated with Amkor’s Product Lifecycle Management (PLM) system to link Design SOPs with a specific design project.
Amkor provides assistance in implementing customer design process improvements. From design concept to post-design characterization, our design process integration experts assist our customers by reducing the time-to-market.
Our Design Process Integration Experts are available to help document your current process and suggest alignment strategies that optimize cycle time, reduce cost, and deliver a quality product.
For more information on our Value Added IC Package Design Services, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.