ATT T1 Factory



 

  ATT T3 Factory

 

ATT T5 Factory

 

 

Taiwan Operation Focus:

Amkor Technology Taiwan provides an extensive offering of advanced package and test services for consumer applications, including turnkey Flip Chip solutions encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers high-volume, 200mm and 300mm electroplated wafer bumping and wafer level packaging (WLCSP) services. Amkor's factories are located near Hsin Chu Science Park offering easy access to foundries and customers.

In addition, our Taiwan manufacturing location is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001, and SONY Green Partner certified industry standards to provide you with consistently reliable, robust and high quality products.

T1 Product/Service Offering:

  • TSOP, LQFP/TQFP (Exposed Die/Stacked Die), MQFP (Stacked/MCM/MCP), MEMS DLP™, WLCSP and 300mm Wafer Bumping


T3 Product/Service Offering:

  • FCBGA, fcCSP, Wafer Probe, Final Test and Die Processing Services


T5 Service Offering:

  • WLCSP, Copper Pillar, 200mm & 300mm Wafer Bumping, PI/BCB/PBO, Copper RDL


Address:

AMKOR TECHNOLOGY TAIWAN, INC. (ATT) - T1
1F, No. 1, Kao-Ping Sec
Chung-Feng Rd.
Lungtan Township, Taoyuan County 325
TAIWAN R.O.C.
Tel: 886.3.411.6000 | Fax: 886.3.471.6420
Email: Sales@amkor.com

AMKOR TECHNOLOGY TAIWAN, INC. (ATT) - T3
11 Guangfu Road,
Hsinchu Industrial Park
Hukou County, Hsinchu 303
TAIWAN R.O.C.
Tel: 886.3.5982000 | Fax: 886.3.5983985
Email: Sales@amkor.com

AMKOR ADVANCED TECHNOLOGY TAIWAN, INC. (AATT) - T5
No. 39 Guang-fu North Rd.
Hsin-chu Industrial Park
Hu-kou Township, Hsin-chu County 303
TAIWAN ROC
Tel: 886.3.597.2777 | Fax: 886.3.597.2891
Email: Sales@amkor.com

 

 

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