Amkor Taiwan provides an extensive offering of advanced package and test services for consumer applications, including turnkey Flip Chip solutions encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers high-volume, 200mm and 300mm electroplated wafer bumping and wafer level packaging (WLCSP) services. Amkor's factories are located near Hsin Chu Science Park offering easy access to foundries and customers. All locations are ISO-9001, QS-9000 and ISO-14001 certified.

AMKOR TECHNOLOGY TAIWAN, INC. (ATT) - T1
AddressOperating Focus
1F, No. 1, Kao-Ping Sec
Chung-Feng Rd.
Lungtan Township, Taoyuan County 325
Taiwan R.O.C.
TAIWAN
Tel: 886.3.4116000
Fax: 886.3.471.6420
Email:
Directions from airport to T1 (PDF)

Design Center
Leadframe Packaging
Sales & Customer Service
Specialty Packaging
Wafer Bumping
Polyimide Repassivation and Multi-Layer Redistribution
Electroplated Wafer Bumping on 300mm
MEMS
Square FootageFacility
307,000 T1
AMKOR TECHNOLOGY TAIWAN, INC. (ATT) - T3
AddressOperating Focus
11 Guangfu Road,
Hsinchu Industrial Park
Hukou County, Hsinchu 303
TAIWAN R.O.C.
TAIWAN
Tel: 886.3.5982000
Fax: 886.3.5983985
Email: Sales@amkor.com
Directions from airport to T3 (PDF)

Wafer Probe & Test
Flip Chip Packaging
Final Test
DSP
Square FootageFacility
314,000 T3
AMKOR ADVANCED TECHNOLOGY TAIWAN, INC. (AATT) - T5
AddressOperating Focus
No. 39 Guang-fu North Rd.
Hsin-chu Industrial Park
Hu-kou Township, Hsin-chu County 303

TAIWAN ROC
Tel: 886.3.5972777
Fax: 886.3.5972891
Email: Sales@amkor.com
Directions from airport to T5 (PDF)

Wafer Level Packaging
Wafer Bumping
Electroplated Wafer Bumping on 200mm and 300mm
Polyimide Repassivation and Multi-Layer Redistribution
Square FootageFacility
101,000 T5

Contact Us



Sign Up to Receive
Updates From Amkor
For Email Marketing you can trust