Amkor Taiwan provides an extensive offering of advanced package and test
services for consumer applications, including turnkey Flip Chip solutions
encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers
high-volume, 200mm and 300mm electroplated wafer bumping and wafer level
packaging (WLCSP) services.
Amkor's factories are located near Hsin Chu Science Park offering easy access to
foundries and customers. All locations are ISO-9001, QS-9000 and ISO-14001
certified.
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| Address | Operating Focus |
1F, No. 1, Kao-Ping Sec
Chung-Feng Rd. Lungtan Township, Taoyuan County 325 Taiwan R.O.C.
TAIWAN
Tel: 886.3.4116000
Fax: 886.3.4716418
Email: Sales@amkor.com
Directions from airport to T1 (PDF)
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Design Center Leadframe Packaging Sales & Customer Service Specialty Packaging
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| Square Footage | Facility |
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307,000
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T1
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| Address | Operating Focus |
11 Guangfu Road,
Hsinchu Industrial Park Hukou County, Hsinchu 303 TAIWAN R.O.C.
TAIWAN
Tel: 886.3.5982000
Fax: 886.3.5983985
Email: Sales@amkor.com
Directions from airport to T3 (PDF)
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Flip Chip Packaging Test Services Wafer Level Packaging Wafer Probe High-End Test
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| Square Footage | Facility |
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314,000
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T3
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| Address | Operating Focus |
Hsin-Chu Industrial Park
No. 39 Guangfu North Road Hsin-Chu Hsein TAIWAN R.O.C.
TAIWAN
Tel: 886.3.5972777
Fax: 886.3.5972891
Email: Sales@amkor.com
Directions from airport to T5 (PDF)
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Wafer Level Packaging Wafer Bumping Electroplated Wafer Bumping on 200mm and 300mm Polyimide Repassivation and Multi-Layer Redistribution
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| Square Footage | Facility |
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101,000
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T5
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