Amkor Taiwan provides an extensive offering of advanced package and test services for consumer applications, including turnkey Flip Chip solutions encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers high-volume, 200mm and 300mm electroplated wafer bumping and wafer level packaging (WLCSP) services. Amkor's factories are located near Hsin Chu Science Park offering easy access to foundries and customers. All locations are ISO-9001, QS-9000 and ISO-14001 certified.