Taiwan Operation Focus:
Amkor Technology Taiwan provides an extensive offering of advanced package and test
services for consumer applications, including turnkey Flip Chip solutions
encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers
high-volume, 200mm and 300mm electroplated wafer bumping and wafer level
packaging (WLCSP) services.
Amkor's factories are located near Hsin Chu Science Park offering easy access to
foundries and customers.
In addition, our Taiwan manufacturing location is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001, and SONY Green Partner certified industry standards to provide you with consistently reliable, robust and high quality products.
T1 Product/Service Offering:
- TSOP, LQFP/TQFP (Exposed Die/Stacked Die), MQFP (Stacked/MCM/MCP), MEMS DLP™, WLCSP and 300mm Wafer Bumping
T3 Product/Service Offering:
- FCBGA, fcCSP, Wafer Probe, Final Test and Die Processing Services
T5 Service Offering:
- WLCSP, Copper Pillar, 200mm & 300mm Wafer Bumping, PI/BCB/PBO, Copper RDL
1F, No. 1, Kao-Ping Sec
Lungtan Township, Taoyuan County 325
Tel: 886.3.411.6000 | Fax: 886.3.471.6420
11 Guangfu Road,
Hsinchu Industrial Park
Hukou County, Hsinchu 303
Tel: 886.3.5982000 | Fax: 886.3.5983985
No. 39 Guang-fu North Rd.
Hsin-chu Industrial Park
Hu-kou Township, Hsin-chu County 303
Tel: 886.3.597.2777 | Fax: 886.3.597.2891