Amkor's China factories are located in the Waigaoqiao Free Trade Zone in Pudong, Shanghai. Our factories produce a broad range of laminate and leadframe packages using chip scale, PBGA, stacked die, flip chip and MicroLeadFrame® formats. Our high-tech C3 facility began operation in mid-2006 and accommodates our long term manufacturing expansion in China.

AMKOR ASSEMBLY AND TEST (SHANGHAI) CO, LTD. (ATC) - C3
AddressOperating Focus
111, Yinglun Road
Waigaoqiao Free Trade Zone
Pudong, Shanghai 200131
CHINA
Tel: 8621.5064.4590
Fax: 8621.5064.4598
Email: Sales@amkor.com
Directions from airport to C3 (PDF)

Design Center
Laminate Packaging
Leadframe Packaging
Flip Chip Packaging
Square FootageFacility
953,000 C3

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