Reliability Policy:

To achieve customer satisfaction through:

  • Conforming industry and customer needs
  • Accurate test and analysis
  • Collection of reliability data
  • Continual enhancement of our products


Regional Laboratories Information:

  • Regional Reliability Labs are located in ATK (Amkor Technology Korea), ATP (Amkor Technology Philippines), ATT (Amkor Technology Taiwan), ATC (Amkor Technology China), ATJ (Amkor Technology Japan), and ATS (Amkor Test Services) for Reliability qualifications, Delamination evaluations and Product analyses. Support laboratories in each manufacturing site for real-time analysis of manufacturing issues.
  • Regional Material Characterization Laboratories in ATK, ATP, ATT, ATC, ATJ, and ATS for Surface, Chemical, and Material analyses.
  • Thermal / Electrical Characterization Labs are in ATK and ATI.
  • Reliability / Stress Modeling Labs are in ATK and ATI for determination of reliability risk before development of the first production package.
  • Regional QRE (ATK, ATP, ATC, ATT and ATJ) positioned beside Research, Technology Development, and Manufacturing.
  • Corporate QRE Group (ATK) positioned beside Product, Sales, Design Center, Marketing, and Technology groups address Product Development and Customer issue resolution.

 

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Reliability and Product Analysis Management

At Amkor Technology, our Reliability and Product Analysis team members have an international perspective on the reliability requirements for the semiconductor industry. Although our focus areas cover from design concept through product discontinuance, our regional laboratories provide all the reliability testing capabilities and product analysis capabilities required to address the complex issues arising from package, material and device interactions. Our group’s charter is to:

  • Assess the reliability risks associated with the introduction of new package designs and technologies via advanced reliability methodologies, reliability models / predictions, process optimizations, reliability monitors, board level characterization, and product / failure analysis.
  • Communicate these risks / results to internal and external customers via periodic, historic and device / customer specific electronically distributed reports.
  • Effect enhancements / corrective actions on any reliability related issues identified by our internal, or our customer’s analyses.


Reliability Focus Area

Qualifications / Evaluations:

  • New Package, Process, Material and Equipment Qualifications
  • Engineering Studies
  • Customer Requests
  • Competitive Comparisons
  • Establish a construction baseline for component qualification or future analysis
  • Design or Supplier evaluation
  • Select vendors and components
  • Evaluate new technologies
  • Identify deviations in supplier process or design of component
  • Recommend lot disposition and corrective action
  • Independently check the quality of the supplier process


Reliability Prediction and Modeling:

  • Interconnect Reliability
  • Die / Package Cracking
  • Die-level analysis and fault isolation
  • Die attach materials and processes, including flip-chip and chip-on-board
  • Interconnections, including wire-bond and flip-chip
  • Chip-on-board and chip-scale-packaging
  • Plastic encapsulation
  • Hermetic packaging
  • Solder joint reliability
  • Solder joint inspection
  • Lead-free solder alloys
  • Solderability testing


Reliability Test Procedure

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Reliability Monitors

  • Long / Short Term Reliability
  • End-of-Line and Post-preconditioning Delamination Monitors
  • Customer Requests
  • Customer Issued
  • Quality Issued
  • Reliability Monitor Program


Product Analysis

  • Surface Analysis Studies
  • Material Analyses
  • Competitive Analysis
  • Construction Analysis
  • Reliability Failure Analysis
  • Customer / Field Failure Analysis


Reliability Studies

  • Acceleration study of moisture sensitivity – 30’C/60%RH –vs-  60’C/60%RH
  • HAST -vs- 85C / 85%
  • Whisker test
  • Moisture absorption/ desorption study


Reports

  • Select Qualifications (Select QUAL)
  • Device / Construction Analysis
  • Quarterly AWW Reliability Monitors
  • Customer Qualifications
  • Engineering Evaluation
  • Failure Analysis results


Product Analysis and Failure Analysis

  • Failure Analysis
    To find the root cause explanation of a component or material deficiency including processing that may contribute to the problem. This may include recommendations for corrective action and/or follow up with the manufacturer.
  • Surface Analysis
    Our experienced engineers supports analysis of electronic components, especially semiconductor devices and assembled printed circuit boards. And also helps solve problems involving process development and engineering for a wide range of thin film and bulk materials: alloys, semiconductors, ceramics, composites and polymers.
  • Non-Destructive Evaluation
    NDE capabilities range from visual inspection using special lighting and polarization to ultrasonic and radiographic techniques. Our experienced engineers can assist in the interpretation of NDE results, select and appropriate.
  • Materials Characterization
    The chemical and metallurgical analyses cover a wide range of components, materials, and structures. The lab's expertise is used for assisting in product / process development, resolving production / material problems, and developing recovery processes to prevent scrap. The Chem Lab also provides expertise in the areas of environmental issues and process evaluation
  • Composites Engineering
    Composite materials & structures, support and protect electronics assemblies. Our experienced engineers can provide technical assistance with design, analysis, test and the manufacture of composite designs. This expertise also covers adhesive bonding and laminating by reliability data
  • Construction Analysis
    Destructive analysis of a part can be used to identify its construction and constituents, as well as to determine variations in the manufacturing process which may effect quality and reliability. After an initial construction analysis can be implemented as an on-going program to assess samples of incoming part lots prior to release in manufacturing. Supplier follow-up may be recommended.


Reliability / FA Activity

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Failure Analysis Equipment

 

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Reliability Methodologies

SelectQUAL: Quals / Evals by Product Life Phase:

  • Five (5) Phases from Concept to End of Life
  • Complexity / Severity Determined by Product  "Maturity"
  • Qual time = 7 weeks average


Stat
Monitor: Short Term and Long Term Rel Stability:

  • "Normal" Delam (wide package coverage)
  • Delam -vs- Long Term Rel (large database)


TRANSit: Process / Product / Technology Transfers:

  • Location to Location
  • Engineering (Development) to Manufacturing


Advance Product Quality Planning (APQP):

  • Package Development Methodology Integrating Design, Manufacturing, Marketing, Sales and Support Groups


For more information on Amkor's Reliability program, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.

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