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2004 Press Releases

12/13/2004
Amkor and PSi Sign Patent License Agreement

12/02/2004
Amkor Reports Favorable Verdict in Mold Compound Litigation

11/22/2004
Amkor Announces Initial Ruling on Carsem Patent Infringement Suit

11/18/2004
Amkor Partners With Sigrity to Enhance SoC Power Delivery Performance

11/12/2004
Amkor, Unitive and SECAP Successfully Conclude Venture for 300mm Electroplated Wafer Bumping Line

10/27/2004
Amkor Closes on $300 Million Term Loan

10/27/2004
Amkor to Present at Investor Conferences

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