Through Silicon Via (TSV) interconnects have emerged to serve a wide range of 2.5D & 3D packaging applications & architectures that demand very high performance and functionality at the lowest energy/performance metric. To enable the use of TSVs in these 2.5D/3D architectures, a number of back?end technology platforms have been developed at Amkor to enable high volume processing of TSV-bearing wafers and assembly.  It is important to distinguish does not provide TSV formation in foundry wafers.  Amkor’s TSV wafer process receives 300mm wafers with TSVs already formed, thin the wafers, and backside metallization to complete the TSV interconnect.

  • Wafer support bond and de-bonding for 300mm wafers
  • TSV wafer thinning
  • TSV reveal
  • Back side inorganic passivation
  • Redistribution
  • Micro-bumping
  • Thin/high density TSV & micro-bump wafer probe
  • Thinned die flip chip die bonding & stacking
  • Green, low stress material sets

 

Amkor’s Role in 2.5D & 3D Packaging with TSV Interconnects

Amkor has enabled TSV technology solutions for the back end processing of TSV based wafers, also referred to as MEOL, and 2.5D/3D IC architectures assemblies. This requires skilled capability in the following key areas:
 

copper pillar micro bumpsWafer support bond and de-bonding (300 mm wafers only)

  • TTV < 5µm
  • Wafer thinning 50µm to 100µm per foundry requirements
  • TSV reveal
  • Back side inorganic passivation and TSV isolation
  • Back side redistribution
  • Micro-bumping

Advanced wafer finishing technology capabilities:

  • 300 mm wafer support system (WSS)
  • Thinning for solid fill copper TSVs
  • Support for TSV reveal wafer processing of incoming wafer with and without FS Flip Chip bumps
  • Ni Au pad finish for fine pitch TSV products
  • Development to 40μm pitch for micro-bumps

Advanced assembly technology capabilities:

  • Flip chip stacking of thin TSV micro-bumped die
  • Chip-to-Substrate flip chip attach (CoS)
  • Chip-to-Wafer flip chip attach (CoW)

 

Examples of products produced to date are provided here as part of the production capability at Amkor

TSV Products 1

TSV Products 2

 

Fine Pitch Copper Pillar Bumping – The backbone of TSV assemblies and advanced packaging

TSV Copper Pillar

 

2.5D & 3D TSV Processing & Assembly Platform

TSV Process platform


For more information on our Through Silicon Via (TSV) Wafer Finishing & Flip Chip Stacking Solutions, please contact an Amkor Regional Sales Office near you or fill out the Request Form

Packaging



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