TSSOP MSOP VSSOPA TSSOP (Thin-Shrink Small Outline Package) / MSOP (Micro Small Outline Package) and VSSOP (Very-thin Shrink Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for pplications requiring less than 1 mm mounted height.

These industry standard packages run in very high volume and provide a value added, low cost solution for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.


TSSOP Services & Support:

Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at low cost.

  • Custom leadframe design
  • Full package characterization
  • Thermal, mechanical stress, and electrical performance modeling
  • Turnkey assembly, test and drop ship
  • World class reliability testing and failure analysis

 

New TSSOP Developments:

  • Stealth dicing (narrow saw streets)
  • Larger / higher density leadframe strips
  • Leadframe roughening for improved MSL capability

 

TSSOP Features:

  • Cu wire interconnect for low cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including strip test options
  • Available in ExposedPad configuration (REF: DS351)
  • Green materials are standard - Pb free and RoHS compliant

 

TSSOP Thermal Performance:

Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity

Pkg Body Size (mm) 0 200 500
16 ld 4.4 x 5.0 137.1 118.2 106.8
20 ld 4.4 x 6.5
114.5 98.0 88.0
28 ld 6.1 x 9.7 82.9 68.7 60.5
48 ld 6.1 x 12.5 82.6 70.3 63.7


Forced Convection, Multi-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity

Pkg Body Size (mm) 0 200 500
16 ld 4.4 x 5.0 89.0
81.8
78.1
20 ld 4.4 x 6.5
73.2 66.6 63.5
28 ld 6.1 x 9.7 49.8 43.9 41.2
48 ld 6.1 x 12.5 58.3 52.3 49.9

 

TSSOP / MSOP Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

 MSL  JEDEC Level 1, 85°C / 85% RH, 168 hrs
 MSL  JEDEC Level 3, 30°C / 60% RH, 192 hrs
uHAST:   130°C / 85% RH, No Bias, 96 hours
Temp cycle:   -65 / +150°C, 500 cycles
High Temp Cycle:  150°C, 1000 hours

 

TSSOP / MSOP Process Highlights:

  • Cu wire bonding standard
  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • NiPdAu (PPF) or Matte Sn lead finish options
  • Laser Mark on package body

TSSOP / MSOP Test Services:

  • Program generation/conversion
  • Wafer probe
  • Burn-in
  • -55 °C to +165 °C test available
  • Strip test available

 

TSSOP / MSOP Shipping Options:

  • Clear anti-static tube, 20 inch
  • Tape and reel
  • Bar code
  • Dry pack
  • Drop ship


For more information on the TSSOP / MSOP package or ExposedPad TSSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form

Packaging



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