Amkor's TSOP is a leadframe based, plastic encapsulated package that is well suited for memory products, including SRAM, FLASH, FSRAM, and EEPROMs. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards.

Amkor has a broad base of resources available to help customers bring new products to market quickly and at the lowest possible cost.

  • Design services, including custom leadframes
  • Package characterization and modeling
  • Turnkey assembly, test and drop ship

TSOP
Amkor’s TSOP packages offer:

  • Cu wire interconnect for low cost
  • Standard JEDEC package outlines 
  • Enhanced design for memory applications
  • Stacked die up to 4X, including stair step and film-over wire (FOW) construction
  • Green materials are standard - Pb free & RoHS compliant
  • Turnkey test services, including strip test options

TSOP Thermal Resistance:

Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity

Pkg Body Size (mm) 0 200 500
32 ld 8 x 14 85.2 66.6 58.5
40 ld 10 x 20 75.0 57.2 48.6
48 ld 12 x 20 80.1 62.4 54.2

 

Forced Convection, Multi-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity

Pkg Body Size (mm) 0 200 500
32 ld 8 x 14 53.2 46.4 43.0
40 ld 10 x 20 44.6 37.6 34.2
48 ld 12 x 20 50.8 43.7 40.0

 

TSOP Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

MSL:   JEDEC Level 3, 30°C / 60% RH, 192 hrs
uHAST:   130°C / 85% RH, No Bias, 96 hours
Temp Cycle:   -65°C / +150°C, 500 cycles
High Temp Storage:
  150°C, 1000 hours

 

TSOP Process Highlights:

  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • Optional Chip-On-Lead (COL) construction using film die attach material and Inner Lead Trace (ILT) leadframes
  • Matte Sn leadfinish is standard
  • Laser marking on package body


Shipping Options:

  • JEDEC outline CS-020 low profile tray
  • Bar code
  • Dry pack
  • Drop ship

 

Test Services:

  • Program generation/conversion
  • Wafer probe
  • Burn-in
  • -55°C to +165°C test available

STACKED TSOP Cross Section:

Stacked TSOP Cross Section

 

TSOP Cross Section:

TSOP Cross Section

 

TSOP Configuration Options:

tsop configurations

For more information on the TSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form

Packaging



Sign Up to Receive
Updates From Amkor
For Email Marketing you can trust