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Amkor offers a broad line of TQFP IC packages. This allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

Amkor’s TQFPs are an ideal package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA / PLD), SRAMs and PC chip sets.

TQFPs are particularly suited for light weight, portable electronics requiring broad performance characteristics. Such applications include laptop PCs, video / audio, telecom, wireless / RF, data acquisition, office equipment, disc drives and communication boards (Ethernet, ISDN, etc.).

TQFPTQFP Features:

  • 5 x 5 mm to 20 x 20 mm body size
  • 32 to 176 lead counts
  • Broad selection of die pad sizes
  • Copper leadframes
  • 1.0 mm body thickness
  • Custom leadframe design available
  • Low stress BOM for stress sensitive products
  • Pb-Free and RoHS compliant materials

 

TQFP Thermal Resistance:

Single-Layer PCB, JEDEC Standard Test Boards Tested @1 W

Theta JA (°C/W) by Velocity

Pkg Body Size (mm) Pad Size 0 200 500
32 ld 7 x 7 5 x 5 69.3 57.8 52.1
64 ld 14 x 14 8 x 8 47.0 38.1 33.9
100 ld 14 x 14 8 x 8 43.4 35.5 31.7



Multi-Layer PCB, JEDEC Standard Test Boards Tested @1 W

Theta JA (°C/W) by Velocity

Pkg Body Size (mm) Pad Size 0 200 500
32 ld 7 x 7 5 x 5 49.5 43.8 41.3
64 ld 14 x 14 8 x 8 35.1 29.8 27.7
100 ld 14 x 14 8 x 8 33.4 28.5 26.4

 

TQFP Electrical:

Simulated Results @100 MHz

Pkg Body Size (mm) Pad Size (mm) Lead Self Inductance (nH) Bulk Capacitance (pF) Self Resistance (mOmega)
176 ld 20 x 20 10 x 10 Longest 4.890 0.871 58.4
176 ld 20 x 20 10 x 10 Shortest 3.490 0.744 43.9

 

TQFP Reliability Qualification:

Moisture sensitivitycharacterization:   JEDEC Level 3 30°C / 60%, 192 hours
PCT:   121°C, 2 atm, 100% RH, 504 hours
Temp / Humidity:   85°C / 85% RH, 1000 hours
High temp storage:   150°C, 1000 hours
Temp cycle:   -65 / +150°C, 1000 cycles

 

Process Highlights:

Die Thickness (max):   11.5 ± .5 mils
Strip Solder plating:   Matte Sn and pre-plated package options, i.e. Ni / Pd frames
Strip Marking:   Laser
Wafer backgrinding:   Available
Lead inspection:   Laser/Optical
Pack/ship options:   Bar code, dry pack


Test Services:

Contact Amkor Test Services for more details.

  • Program generation / conversion
  • Product engineering 
  • Wafer sort
  • 256 pin x 20 MHz test system available
  • Burn-in
  • -55 °C to +165 °C test available


Shipping:

  • JEDEC outline CO-124 low profile tray

 

TQFP Cross Section:

TQFP Cross Section

 

TQFP Configuration Options:

TQFP Nominal Package Dimensions (mm)

TQFP Configurations

For more information on the TQFP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form. 

Packaging