SSOP (Shrink Small Outline) & QSOP (Quarter-Size Small Outline) are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with applications requiring compressed body size and tightened lead pitch. These industry standard IC packages yield a significant reduction in size while running in high volume and provide value added low cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.
Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.
Amkor’s SSOP package portfolio provides:
Multi-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity
|Pkg>||Body Size (mm)>||Pad Size (mm)>||0>||200>||500>|
|20 ld||3.9 x 8.7||2.4 x 3.6||80.8||73.2||69.2|
|28 ld||5.3 x 10.2||3.84 x 8.10||49.0||36.0||30.0|
Simulated Results @ 100 MHz
|Pkg||Body Size (mm)||Pad Size (mm)||Lead||Inductance (nH)||Capacitance (pF)||Resistance (mOmega)|
|20 ld||5.3 x 7.2||3.9 x 5.4||Longest||2.260||0.395||19.0|
|20 ld||5.3 x 7.2||3.9 x 5.4||Shortest||0.958||0.209||9.10|
|28 ld||3.9 x 9.9||2.4 x 4.8||Longest||1.590||0.376||14.1|
|28 ld||3.9 x 9.9||2.4 x 4.8||Shortest||0.757||0.198||7.53|
|28 ld||5.3 x 10.2||3.9 x 5.1||Longest||2.510||0.463||21.5|
|28 ld||5.3 x 10.2||3.9 x 5.1||Shortest||0.928||0.206||9.57|
Package reliability is assured for worry-free operation
|MSL:||JEDEC Level 1, 85°C / 85% RH, 168 hrs|
|MSL:||JEDEC Level 3, 30°C / 60% RH, 192 hrs|
|uHAST:||130 °C / 85% RH, No Bias, 96 hours|
|High Temp Storage:||150°C, 1000 hours|
|Temp Cycle:||-65 / +150°C, 500 cycles|
Contact Amkor Test Services for more details.