SOT-223 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in discrete packaging. Amkor Technology: SOT-223 Package | SOT223 | Small Outline Transistor

SOT-223 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in discrete packaging. This industry standard package utilizes a large tab (lead 2 and tab 4 are common) to accommodate the needs of higher power devices in a small foot print while providing high volume and value added, low cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.

SOT-223SOT-223 Features

  • Standard JEDEC package outline
  • Common tab configuration for increased thermal efficiency
  • Turnkey test services, including strip test options
  • Green materials are standard – Pb free and RoHS compliant

SOT-223 Process Highlights

  • Wafer backgrinding services available
  • iPdAu (PPF) or Matte Sn leadfinish options
  • Laser marking on package body
  • Ag filled epoxy die attach standard
  • Sintered die attach material optional

 

Reliability Qualification

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

  • MSL-JEDEC Level 1: 85°C / 85% RH, 168 hours
  • uHAST: 130°C/85% RH, No bias, 96 hours
  • Temp cycle: -65/+150°C, 500 cycles
  • High temp storage: 150°C, 1000 hours

 

Test Services

  • Program generation / conversion
  • Wafer probe
  • Burn-in
  • -55°C to +165°C test available
  • Strip test available

 

Service and Support

Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.

  • Open tooled stamped leadframes
  • Full package characterization
  • Thermal, mechanical stress and electrical performance modeling
  • Turnkey assembly, test and drop ship
  • World class reliability testing and failure analysis
  • Shipping Options
  • Aluminum cannister
  • Bar Code
  • Dry Pack
  • Drop Ship

 

Configuration Options


SOT-223 Nominal Package Dimensions (mm)

Package Type Lead Count
Body Width
Body Length
Body Thickness Standoff (MAX) Overall Height Lead Pitch Tip-to-Tip JEDEC
SOT-223 4 6.5 3.5 1.60 0.10 1.00 1.80 7.00 TO-261


SOT-223 Cross Section:

SOT-223 Cross Section

 SOT-223 Pins:

 SOT-223 Pins
For more information on the SOT-223 package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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