Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. With more than 1 billion SiP devices assembled and tested over more than 10 years, Amkor Technology has a proven track record as the industry leader in SiP assembly technology. Contact us today and let us add you to our growing list of customers who have been successful with System in Package technology.

What is System in Package?


System-in-Package (SiP) is more than just an IC package containing multiple die. Amkor defines SiP as: System in Package is characterized by any combination of one or more Integrated Circuit(s) of different functionalities, which may include passive components and/or MEMS assembled into a single package that performs as a system or sub-system. SiP may contain one or more IC chips (either wirebonded,flip chip, or both) plus other components that are traditionally found on the system mother board such as:

  • Surface mount discrete passive (any common format including 01005 size)
  • SiP PodIntegrated passive networks (IPN)
  • Integrated passive devices (IPD, either glass or Si type)
  • Passives embedded inside or patterned on the substrate
  • Die embedded in the package substrate
  • SAW/BAW filters
  • EMI shields
  • Pre-packaged ICs
  • Connectors
  • Mechanical parts


The power of SiP is the ability to bring together many IC and package assembly and test technologies to create highly integrated products with optimized cost, size and performance.

Total System in Package Solutions


In an SiP approach, one must consider not only the traditional elements of package assembly, but also design aspects relating to the overall system functional requirements and manufacturing process, as well as supply chain management and test.

System design becomes paramount to the overall success of developing a System in Package. Early in the overall system design, the customer and Amkor discuss and agree upon all elements of the system requirements to ensure success of the design. With this in mind, Amkor has significantly expanded our design capability to combine traditional layout expertise with digital and RF circuit design and system modeling. Amkor can also translate your reference designs for use in SiP development. Working closely with the customer, Amkor can model circuits electrically, mechanically and thermally, which will reduce design iterations and minimize time-tomarket.

After modeling, Amkor can prototype the package using production capable equipment to ensure ease of transfer into one of our high volume factory sites. Supply chain considerations play a major factor in the success of SiP product realization and impact both design and manufacturing. Amkor has expanded its traditional supply chain expertise into passive components, and other parts not traditionally found in the package assembly environment. Amkor can manage the supply chain to ensure successful SiP development and production.

Thermal Solutions for SiP


Inevitably, higher levels of integration result in thermal challenges. As part of our co-design service, we capture not only electrical but also thermal constraints early on so that the package solution will meet all your performance criteria. Amkor has a menu of thermal enhancement options to ensure that your die runs cool and we can deploy any of the following for your device:

  • Thermal vias
  • Stacked Cu-filled via structures
  • Thermal “breadloaf” structures using coreless laminate
  • Direct-to-metal die attach pad structure
  • Enhanced thermal die attach compound
  • Enhanced thermal mold compound
  • Molded-in heatspreaders


As part of our co-design service we will help you identify the optimum nd most cost-competitive thermal enhancements that your device equires to satisfy your customer’s operating conditions and field life expectations.

Markets for System in Package


Existing market uses for SiP include RF and wireless devices (such as power amplifiers, GPS/GNSS modules, cellular handset and cellular infrastructure, Bluetooth® solutions), Netbooks, digital baseband solutions for the wireless markets and controllers for hard drives in the storage market, and automotive applications including under-hood ECU, sensory modules and infotainment.

SiP technology can also be used to enhance single component packages that require improved circuit performance and reduced board real estate. System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application.

Amkor is heavily involved in providing SiP solutions for RF and wireless applications such as digital cellular, Bluetooth®, 802.11 modems and GPS. We have RF design engineers on staff to assist customers in designing RF SiPs, including creating circuit elements (e.g., baluns and filters) in the substrate which may eliminate discrete components. Amkor is able to meet all design, material and manufacturing requirements for RF SiPs, including such items as wire length control and substrate materials (LTCC, laminate and others). We have successfully used our RF design and packaging capability to integrate shields and antennas directly into the SiP.

Amkor has developed expertise in RF testing including test system software/hardware development and manufacturing test. We have an internally-developed, world class test platform that typically offers a 50% to 80% reduction in test time for common RF parts -- PAs, LNAs, and combinations in Integrated Front Ends (IFE).

System in Package Benefits


As with System on Chip (SoC), Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing. Amkor Technology has leveraged its single chip assembly and test technology into SiP development.

Additional Benefits of s System in Package Approach

  • Smaller size solution than individually-packaged ICs
  • Higher performance through shorter interconnect paths, better dimensional tolerances and local shielding
  • Lower overall cost of ownership
    • Eliminate packaging (multiple ICs now in one package)
    • Reduces system board complexity and layer count by moving to the SiP
    • Uses less system board space than individually packaged ICs
    • Reduced overhead for the customer (Amkor offers turnkey solutions for assembly, test, supply chain management and value-added services)
    • Known good modules
  • Reduced time to market - The modules and main system assembly can be developed concurrently
    • Changes can be made to the SiP without costly changes to the system board
    • Design flexibility and easy redesign versus complex System on Chip design
    • SiP allows plug-and-play insertion into one or multiple systems
  • With proper consideration to design, Amkor’s SiP packages are able to meet JEDEC L3/260 moisture resistance and are passing Amkor’s internal SQLb.


System in Package is the modular design approach offering unprecedented flexibility in product development. The end user benefits from a faster time-to-market, reduced cycle times for system design, lower development risk as compared to SoC IC development, flexibility, tuned functional performance, and in the end, a lower overall cost of ownership.

Global Manufacturing Footprint for SiP


Amkor has a very broad global footprint for assembly and test, and offers SiP capability at each of our main factories. Our primary centers for mass production are in the Philippines (P3) and Korea (K4) but SiP packaging can be supported at additional locations. Amkor SIP factories are equipped with the latest generation surface mount equipment to provide these attributes:

  • Ultra high-speed SMT placement machines which have leading edge component placement accuracy – best quality and lowest cost.
  • Flexible placement machines which are better suited for odd-form component placement
  • Capable of placing any common component format available in tape
  • and reel format down to and including the smallest 01005 size.
  • Capable of mounting bumped die directly from wafer tape
  • Solder paste stencil printing, flux stencil printing, flux jetting or flux dipping are all supported processes.
  • 100% inline solder paste automatic optical inspection is available
  • All common RoHS/Green compliant solder alloys are supported


Amkor supports SiP production in many different package formats including both laminate and leadframe molded array format along with PBGA, and capturing both wire bond or flip chip first level connectivity. In addition, Amkor supports a wide variety of custom packages such as daughter cards, fingerprint sensors, etc. 

Cross-section SuperFC SiP

Cross-section SuperFC SiP

 

Cross-section SiP-PBGA

Cross-section SiP-PBGA

 
Cross-section SiP-CABGA

Cross-section SiP CABGA


System in Package Manufacturing Sequence

 Sip Manufacturing

 For more information on System in Package (SiP), please contact an Amkor Regional Sales Office near you or fill out the Request Form

Packaging



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