Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Contact us today and let us add you to our growing list of customers who have been successful with System in Package technology.
In an SiP approach, one must consider not only the traditional elements of package assembly, but also design aspects relating to the overall system functional requirements and manufacturing process, as well as supply chain management and test.
System design becomes paramount to the overall success of developing a System in Package. Early in the overall system design, the customer and Amkor discuss and agree upon all elements of the system requirements to ensure success of the design. With this in mind, Amkor has significantly expanded our design capability to combine traditional layout expertise with digital and RF circuit design and system modeling. Amkor can also translate your reference designs for use in SiP development. Working closely with the customer, Amkor can model circuits electrically, mechanically and thermally, which will reduce design iterations and minimize time-to-market.
Amkor’s “Center of Excellence” for substrate-based SiP technology is located in our largest volume manufacturing facility in K4 Kwangju, South Korea. The large-scale manufacturing capabilities in this factory can achieve significant volume production support with very short cycle times. The manufacturing equipment is the latest advanced technology that supports high speed, high accuracy chip and component placement. Amkor’s SiP design rules are the most advanced in the industry and are available to customers through a web portal access system. Amkor production lines have full automation, in-line inspection, RFID control and other process control methods to ensure the highest yields and quality while minimizing any potential loss of bill of material (BOM) components.
Amkor SiP factories are equipped with the latest generation surface mount equipment to provide these attributes:
After modeling, Amkor supports Engineering Build Requests (EBRs) on dedicated rapid-turn “New Product Introduction” lines. These lines are exactly the same as the high volume manufacturing lines so transfer to production is seamless and efficient. In the RF market sector, Amkor often needs to support a large number of rapid-turn EBRs to facilitate RF tuning of the parts. Fast turn is critical to product success and time-to-market, our experts work closely with our customer’s to facilitate this collaborative process.
Supply chain considerations play a major factor in the success of SiP product realization and impact both design and manufacturing. Amkor has expanded its traditional supply chain expertise into passive components, and other parts not traditionally found in the package assembly environment. Amkor can manage the supply chain to ensure successful SiP development and production.
Inevitably, higher levels of integration result in thermal challenges. As part of our co-design service, we capture not only electrical but also thermal constraints early on so that the package solution will meet all customer performance criteria. Amkor has a menu of thermal enhancement options to ensure that your die runs cool, including:
As part of the co-design service, Amkor helps identify the optimum and most cost-competitive thermal and mechanical enhancements required by a device to satisfy the end customer’s operating conditions and field life expectations.
Existing market uses for SiP include:
System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application.
Amkor is heavily involved in providing SiP solutions for RF, digital and mixed-signal applications. We have RF and high-speed digital design engineers on staff to assist customers in designing SiPs for their applications. Amkor is able to meet all design, material and manufacturing requirements for RF and high-speed digital SiPs.
Amkor developed an excellent sputtering shielding technology to solve electromagnetic radiation effects among electronic components within SiP components and surrounding environment. Conformal shielding is used to replace bulky metal shielding. It has zero impact on package size and weight, with excellent electrical and magnetic shielding performance.
Amkor has developed expertise in RF and digital testing including test system software/hardware development and manufacturing test. Our internally-developed, world-class test platform typically offers a 50% to 80% reduction in test time for common RF parts – PAs, LNAs and combinations in integrated front ends (IFEs).
Similar to a system on chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
System in Package is the modular design approach offering unprecedented flexibility in product development. The end user benefits from a faster time-to-market, reduced cycle times for system design, lower development risk compared to SoC IC development, flexibility, tuned functional performance, and, in the end, a lower overall cost of ownership.