Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit these applications. This solution provides improved power dissipation, achieved by using an exposed heat slug. This large, highly efficient Cu and/ or Al heat slug readily extracts heat generated from the chip though the leadframe paddle to which the IC is attached. Thermal resistance improvements of approximately 80% (over a standard QFP) can be realized with this IC package without the use of any external cooling aids!
Finally, the MQFP PowerQuad® 4 heat slug has a built-in mechanical package-encapsulant "lock" feature to ensure package integrity and eliminate moisture penetration. The end result is a moderate power, IC package with the properties to enable more reliable solutions to the electronic marketplace.
PowerQuad® 4 provides today's semiconductor ICs with a package to operate at the speeds and power for which they were designed. This is why PowerQuad® 4 was chosen by packaging engineers from major Semiconductor manufacturers in the industry as the IC package of choice for DSPs, PLDs, microprocessors, microcontrollers, high-speed logic / FPGAs, ASICs, digital signal processor (DSP), automotive devices, thin low airflow, high performance applications and other similar technologies requiring moderate power management.
System designers and OEM product developers have used PowerQuad® 4 to solve power / thermal / speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support) in uses like: PCs, notebooks, high-end audio/video, power supplies, CPU board systems, workstations, RISC engine modules and many other similar applications.
Amkor's MQFP PowerQuad® 4 thermal handling capabilities are supported by these additional attributes:
Multi-Layer PCB, Pre-JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity w Cu Heat Slug
|Pkg||Body Size (mm)||Pad Size (mm)||0||200||500|
|208 ld||28 x 28||11||13.3||10.8||9.4|
|240 ld||32 x 32 ||12.7||13.2||10.6||9.2|
Simulated Results @100 MHz
|Pkg||Body Size (mm)||Pad Size (mm)||Lead||Inductance (nH)||Capacitance (pF)||Resistance (mOmega)|
|208 ld||28 x 28||9.5 x 9.5||Longest||12.000||1.730||95.5|
|208 ld||28 x 28||9.5 x 9.5||Shortest||6.850||1.470||81.0|
|240 ld||32 x 32||10.6 x 10.6||Longest||15.72||2.123||227.0|
|240 ld||32 x 32||10.6 x 10.6||Shortest||12.12||1.841||205.7|
MQFP PowerQuad® 4 is assembled with proven reliable performance to industry standard JEDEC test methods.
MRT / Autoclave:
|L3 245°C / 121°C, 2 atm, 504 hours|
|Temp / Humidity:||85°C / 30% RH, 1000 hours|
|High temp storage:||150 °C, 1000 hours|
|Temp cycle:||-65/+150 °C, 1000 cycles|
|Die Thickness (max):||25 mil|
|Strip Solder plating:||Matte Sn Standard, 85/15 Sn/PbOption|
|Marking:|| Laser Mark|
|Lead inspection:|| Laser / Optical|
|Pack/ship options:||Bar code / Dry pack|
Contact Amkor Test Services for more details.