ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch. These industry standard IC packages offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.

ExposedPad TSSOP

Features:

  • Cu wire interconnect for lowest cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including strip test options
  • ExposedPad configuration for increased thermal efficiency
  • Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
  • Green materials are standard - Pb free and RoHS compliant

 

Services and Support:


Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.

  • exposedpad soic ssopCustom leadframes
  • Full package characterization
  • Thermal, Mechanical and Stress and Electrical performance modeling
  • Turnkey assembly, test and drop ship
  • World class Reliability testing and Failure analysis

 

New Developments:

  • Stealth dicing (narrow saw streets)
  • Larger / Higher Density leadframe strips
  • Leadframe roughening for improved MSL capability

 

Thermal Performance:

Forced Convection, Single-Layer PCB; JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) Pad Size 0 200 500
MSOP 8LD*
3.0 x 3.0
1.73 x 2.39 38.0 33.0 31.0
TSSOP 16LD* 4.4 x 5.0 3.0 x 3.0 37.6 32.3 30.2
TSSOP 20LD 4.4 x 6.5
 3.0 x 4.2 37.6 32.3 29.9
TSSOP 28LD* 4.4 x 9.7
 3.0 x 5.5 37.0 32.0 29.0
TSSOP 56LD* 6.1 x 14  4.7 x 5.5 33.5 30.0 28.0
SOIC 8LD
3.9 x 4.9 2.3 x 2.3 58.652.1
49.4
SSOP 16LD 3.9 x 4.9
 2.4 x 2.3 4.3 38.5 36.1

* = Estimates

Electrical Performance:

Simulated Results @100 MHz

PkgBody Size Pad SizeCenter Inductance
(nH)
Corner Inductance
(nH)
MSOP 8 ld3.0 x 3.0
1.73 x 2.39
1.50
2.20
TSSOP 16 ld4.4 x 5.0
3.0 x 3.0
1.582.28
TSSOP 20 ld
4.4 x 6.5
3.0 x 4.2
1.682.45
TSSOP 28 ld
4.4 x 9.73.0 x 5.5
1.702.65
TSSOP 56 ld
6.1 x 14
4.7 x 5.5
1.902.85

 

Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

MSL:   JEDEC Level 1,  85°C / 85% RH, 168 hrs
MSL:   JEDEC Level 3,  30°C / 60% RH, 192 hrs
uHAST:   130°C / 85% RH, No Bias, 96 hrs
HTS:   150°C, 1000 cycles
Temp cycle:   65°C / +150°C, 500 cycles

 

Process Highlights:

  • Cu wire bonding standard
  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • NiPdAu (PPF) or Matte Sn lead finish options
  • Laser Mark on package body


Test Services:


Shipping:

  • Clear anti-static tube, 20 inch
  • Tape and reel
  • Bar code
  • Dry pack
  • Drop ship

 

Cross Sections:

exposedpad tssop soic cross section

 

Package Configuration Options:

ExposedPad MSOP, ePad TSSOP, ePad SOIC, ePad SSOP Nominal Package Dimensions
(units in mm unless otherwise noted)

exposedpad tssop soic options

 
For more information on the ExposedPad TOSSP, ExposedPad MSOP, ExposedPad SOIC, & ExposedPad SSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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