ExposedPad™ is a thin, cost effective, thermal and high frequency package solution. ExposedPad™ products are made using leadframes with a 'deep downset' die attach paddle which is exposed to the outside of the package after the mold process. Since ExposedPad™ products are offered in standard package outlines, most materials and production capacities are shared.

ExposedPad™ products are typically assembled in die up configuration with the die attach paddle soldered directly to the printed circuit board. Loop inductance can be significantly reduced by using the die attach paddle as ground.

Features and Benefits

• Low Profile (1.2 mm max mounted height)
• Low Loop Inductance
• Excellent Thermal Performance
• Cost Effective

Markets and Applications

ExposedPad™ products are an excellent choice for any application that requires a thin, cost effective, thermally and electrically enhanced package solution. Maximum thermal and electrical performance is 4 W and 2.4 GHz, respectively. Applications include wireless and RF devices, cellular phones, personal / notebook / handheld computers and disk drives.

Market Strategy

ExposedPad™ products were designed to benefit power amp and micro-controller manufacturers who sell to the portable electronics market as well as companies that supply to the cell phone market for use with RF front end devices. Many RF devices require GaAs wafer technology. Amkor has the ability to support various GaAs die formats. More information is available in Amkor's GaAs position paper.

Other wireless applications that require high frequency and medium power solutions such as transceivers, receivers, and tuners can also be accommodated.

Many disk drive applications such as pre amps and micro controllers are well suited for ExposedPad™ products due to their improved thermal performance and low cost.

ExposedPad™ Cross Section Drawing:

Additional Information:

Description	File Type	File Size
ExposedPad™ FAQ		15 kb
ExposedPad™ LQFP / TQFP Data Sheet		102 kb
ExposedPad™ SOIC / SSOP Data Sheet		112 kb
ExposedPad™ TSSOP Data Sheet		77 kb
FusionQuad™ Data Sheet		319 kb
Application Notes for Surface Mount   Assembly of Amkor's Thermally / Electrically   Enhanced Leadframe Based Packages		255 kb

For more information on ExposedPad™ Technology Solutions, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.