3-dimensional (3D) packaging technologies exploit the third or Z height dimension to provide a volumetric packaging solution for higher integration and performance. 3D packaging has become critical to integrating the multi-media features consumers demand in smaller, lighter products. This increasing functionality requires higher memory capacity in more complex and efficient memory architectures. New product designs (cell phones, digital cameras, PDAs, audio players and mobile gaming) demand that these features be delivered in innovative form factors and styling. 3D packaging is experiencing high growth and new applications by delivering the highest level of silicon integration and area efficiency at the lowest cost.

Amkor’s Role in 3D Packaging Innovation

Since 1998, Amkor Technology has been a pioneer in developing and providing high volume, low cost 3D packaging technologies. Amkor understood the benefits that 3D packaging provided which would address a wide range of device combinations and end product applications. Thus a platform technology development through deployment approach was created to transcend the range of applications and packaging platforms requiring 3D technology. Customers continue to benefit from this approach as new 3D packaging solutions are more effectively qualified and ramped to high volume, at low cost and across multiple factories. The critical 3D platform technologies include:

• Design rules and infrastructure for thinner, high density substrate technologies
• Advanced wafer thinning and handling systems
• Thinner die attach and die stacking processes
• High density and low loop wire bonding
• Pb free and environmentally conscious "Green" material sets
• Flip chip plus wire bond mixed technology stacking
• Turnkey die and package stacking assembly and test flows

Benefits of Three Dimensional Packages

The high growth and development of multiple 3D packaging technologies are due to the system level benefits provided, including:

• Size and weight reduction through more semiconductor functions per cm² of PWB space and cm³ of application space
• Enables more design freedom to create innovative new form factors and styling through volumetric packaging approach
• Enables higher electrical performance through shorter interconnect architectures with stacking
• Reduced system level costs

Die Stacking

Amkor's die stacking technologies are widely deployed in high volume manufacturing across multiple factories and product lines. The key features: reliability, process and materials data are listed in the Stacked CSP data sheet. Customers rely on Amkor's turnkey and leading edge capabilities in design, assembly and test to solve their most complex 3D packaging or time to market challenges. Next generation die stacking technology includes the ability to handle wafers and die thinned down to 50µm. It can then be reliably stacked and interconnected with up to 5 active devices high, employing leading edge die attach, die spacing, wire bond and flip chip assembly capabilities. Die stacking technologies have been demonstrated up to 9 high stacks, however, most stack ups greater than 4 devices high use a combination of die and package stacking technologies to address complex test, yield and logistic limitations..

Die stacking is also widely deployed in conventional leadframe-based packages including QFP, MLF^® and SOP formats. Leveraging Amkor’s industry leading infrastructure for high volume, low cost leadframe production, system designations can achieve significant savings in PCB real estate and overall cost.

Package Stacking

Stacking of fully assembled and tested packages is an area Amkor has provided significant innovation to overcome the technical, business and logistics limitations associated with complex die stacks. In 2000, Amkor introduced the etCSP^® for new thin mobile products requiring a fine pitch BGA with less than 0.5 mm mounted height. At this time, collaboration was initiated with leading cellphone, semiconductor and SMT equipment suppliers to establish the infrastructure and platform technologies for Package on Package (PoP) stacking. From this work, Amkor has launched a family of package stackable (PS) products including PS-etCSP and PSvfBGA that address the range of thickness, density combinations and logistics flexibility required in leading edge multi-media products. This PoP family enables the stacking of high density logic + memory device combinations with the lowest total cost of ownership. PoP solutions are achieving rapid industry adoption because the technical, business, logistic and cost benefits are realized across the supply chain — the end product, logic and memory device providers.

Digital camera and cell phone applications are currently stacking 2 packages for logic + memory architectures. High density DRAM and Flash memory modules are stacking up to 4 packages high, with this capability demonstrated to 8 high stacks.

Amkor Technology continues the commitment to solve tomorrow's multi-media and system integration challenges by employing innovative and cost effective 3D and system in a package (SiP) technologies.

Additional Information:

Description	File Type	File Size
3D Technology Solution Sheet		204 kb
3D Technology Solution Sheet (Japanese Translation)		543 kb
Stacked CSP Data Sheet		118 kb
PSvfBGA Data Sheet		502 kb
etCSP® Data Sheet		147 kb
System in Package (SiP) Technology Solution   Sheet		92 kb

For more information on 3D | Stacked-Die Technology Solutions, please contact the Amkor Regional Sales Office nearest you, contact your Account Manager, or fill out a Request for Additional Information Form.