Microelectronic Assembly and Test - Yes We Do That!
Technology Leadership with Cost Effective High-Volume Manufacturing
Amkor is one of the world's largest providers of semiconductor assembly and test services. Each year we
package billions of semiconductor chips, representing approximately 7% of the world's IC packaging
requirements. In addition to producing some of the highest volume, lowest cost traditional microelectronic
packages, Amkor is a leader in the latest packaging technology, enabling our customers to produce their products to meet today’s market demands.
MicroLeadFrame® (MLF®)
Amkor's MicroLeadFrame® packages provide a cost-effective answer to the demand for small size and high-performance
integrity in a cost-effective leadframe package, including exceptional RF and thermal management characteristics,
enabling greater capability in smaller spaces for portable devices.
Wafer Bumping / Wafer Level Packaging / Flip Chip Technology
Amkor is a leader in wafer-bumping technology for silicon and smaller, high-speed applications. Amkor's flip chip
solutions for high bandwidth and wireless / RF applications improve signal integrity, performance and reduce costs for
highest performance ASICs. Flip chip interconnection improves signal integrity by significantly decreasing inductance
and improving impedance. This allows direct power routing to the center of the die, decreasing the power and ground
loop inductance and utilizing the entire die. The design permits die shrinks that translate into significant silicon cost
savings and smaller package footprint. Through our acquisition of Unitive®, Amkor now offers the world’s leading
technology for electroplated wafer bumping of 200 mm and 300 mm wafers.
Stacked and 3D
Innovative end use products challenge IC package-mounted height requirements to new extremes. Amkor
provides extremely thin single-chip and 3D packaging technologies that enable a range of emerging applications
requiring highly-integrated solutions. Amkor's enabling technologies in thin or 3D package platforms provide
ongoing advancements in package form factor, electrical, thermal and reliability, allowing 2x to 3x density in the same
footprint.
System in Package (SiP)
Amkor's SiP module, consisting of multiple semiconductor chips and passive circuit elements in a modified
conventional IC package, is perfect for the expanding integration needs of a cost-sensitive market. SiPs are an ideal
solution for high-speed switches, memory modules and wireless applications. Amkor offers a full service SiP
approach from design to test.
Memory, Game & I/O Cards (AmKard®)
Amkor has expanded its assembly technology and test capacity to include flash memory cards that achieve higher
storage densities. These applications include the use of stacked die to meet the growing market requirements of
digital photography and digital audio equipment.
Micro-ElectroMechanical Systems (MEMS)
Amkor Technology is the world's largest independent packaging provider of microelectromechanical systems
(MEMS), micron-sized devices that manipulate the physical world. These extremely small, fast, precise and
reliable devices are most commonly used in optical switching, medical and transportation devices, airbag
sensors, game controllers and other industrial and consumer products.
Lead-Free / Green Packages / Pb-Free / Environmentally Friendly
Amkor Technology offers alternative package styles that are environmentally friendly, including lead-free and
green packaging that maintain performance, reliability and high-quality standards. Amkor offers green
packaging in laminate and leadframe packages.
RF and Other Test Services
The explosive demand for wireless and RF devices creates a need for test services. Amkor offers complete, end-to-end test solutions and is a leader in RF test.
Automated Package Design
Amkor uses automated package design tools that ensure your market design-to-production demands are met.
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