VisionPak® LCC Image Sensor
 Amkor's VisionPak® Leadless Chip Carrier (LCC) design offers a high temperature co-fired ceramic (HTCC) ceramic substrate with an optically clear lid. Assembly features fully automated UV epoxy dispensing and precision glass placement, providing the accuracy required in image capture applications.
The VisionPak® standard footprint is a CLCC with 0.2 mm castellations. Open tools are available in various body sizes. In addition, VisionPak® can also be provided in a similar outline in an LGA format.
Amkor's manufacturing line uses advanced assembly technology in a state-of-the-art Class 100 clean room with raised floor to minimize particulate contamination of the image sensor.
The VisionPak® LCC offers a cost-saving alternative featuring matrix assembly, quick cure die attach with the same advanced assembly, test and precision die and glass placement.
Applications:
Amkor's VisionPak® LCC is designed to provide a flexible packaging solution for the optical device marketplace. The package is specifically developed for optical products including digital still cameras, machine vision, scanners, sensors, biometric devices and IR monitors.
Features:
Exceptional performance by innovative design provides the following:
- Standard industry LCC footprint
- Full in-house design capability
- Cost-effective manufacturing process
- Custom package sizes and pin counts
- Experienced engineers in image sensor assembly
- One stop shop for design, development, and manufacturing for image sensor packaging
Thermal Performance:
Theta JA (°C/W) by air velocity (m/s)
| Lead Count |
Body Size (mm) |
Die Size (mm) |
0 |
1 |
2.5 |
| 28 |
11.43 |
6.6 x 6.6 |
26.08 |
22.61 |
21.03 |
| 32 |
10.66 |
5.9 x 4.7 |
32.25 |
27.94 |
26.29 |
| 40 |
12 |
5.4 x 5.1 |
51.3 |
46.2 |
43.97 |
| 48 |
14.22 |
8.9 x 8.9 |
20.17 |
17.45 |
16.2 |
Reliability:
Amkor's VisionPak® LCC are reliability assured through optimized design, material and process enabling high performance operation for your CMOS image sensor.
| Moisture sensitivity: |
JEDEC Level 3; 30°C / 60% RH, 192 Hrs |
| Temp Cycle Condition C: |
-65°C / +150°C, 500 cycles |
| HAST: |
130°C / 85% RH, 96 hours |
| High temp storage: |
150°C, 1000 hours |
| Dew Point: |
-20°C |
Process Highlights:
| Optical device assembly: |
ISO Class 100 Clean room |
| Die rotation control: |
2° max |
| Die tilt control: |
< 2 mils max |
| Sealing process: |
Automated |
| Wafermap capability: |
Available |
Standard Materials:
| Package Substrate: |
High temp co-fired Ceramic |
| Die attach adhesive: |
Conductive epoxy |
| Wire: |
1.0 mil Diameter, Au |
| Glass adhesive: |
Epoxy |
| Lid: |
Optical grade Boro-silicate glass |
Shipping:
VisionPak® LCC Cross Section:
Additional Information:
| Description |
File Type |
File Size |
| VisionPak® LCC Data Sheet |
 |
132 kb
|
| CMOS Image Sensor Camera Module Data Sheet |
|
230 kb
|
For more information on the VisionPak® LCC package, please contact an Amkor Regional Sales Office near you or fill out the Request for Additional Information Form. |
