Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

Applications:

Amkor's TQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets.

TQFPs are, by their very nature, particularly suited for light weight, portable electronics requiring broad performance characteristics. Such applications are laptop PCs, video/audio, telecom, cordless/RF, data acquisition, office equipment, disc-drives and communication boards (Ethernet, ISDN, etc.) to name a few.

Features:

Amkor's TQFP IC package portfolio provides:

• 5 x 5 mm to 20 x 20 mm body size
• 32 to 176 lead counts
• Broad selection of die pad sizes
• Copper leadframes
• 1.0 mm body thickness
• Custom leadframe design available
• Rapid cure mold compound
• Low stress die attach adhesive

Mechanical Samples:

For mechanical samples of our TQFP package, please click here.

Thermal Resistance:

Single-Layer PCB, JEDEC Standard Test Boards Tested @1 W

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	Pad Size	0	200	500
32 ld	7 x 7	5 x 5	69.3	57.8	52.1
64 ld	14 x 14	8 x 8	47.0	38.1	33.9
100 ld	14 x 14	8 x 8	43.4	35.5	31.7

Thermal Resistance:

Multi-Layer PCB, JEDEC Standard Test Boards Tested @1 W

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	Pad Size	0	200	500
32 ld	7 x 7	5 x 5	49.5	43.8	41.3
64 ld	14 x 14	8 x 8	35.1	29.8	27.7
100 ld	14 x 14	8 x 8	33.4	28.5	26.4

Electrical:

Simulated Results @100 MHz

Pkg	Body Size (mm)	Pad Size (mm)	Lead	Self Inductance (nH)	Bulk Capacitance (pF)	Self Resistance (m)
176 ld	20 x 20	10 x 10	Longest	4.890	0.871	58.4
176 ld	20 x 20	10 x 10	Shortest	3.490	0.744	43.9

Reliability:

Moisture sensitivity       characterization:	JEDEC Level 3         30 °C/60%, 192 hours
PCT:	121 °C, 2 atm, 100%RH, 504 hours
Temp / Humidity:	85 °C/85% RH, 1000 hours
High temp storage:	150 °C, 1000 hours
Temp cycle:	-65/+150 °C, 1000 cycles

Process Highlights:

Die Thickness (max):	11.5 ± .5 mils
Strip Solder plating:	85/15 Sn/Pb
Strip Marking:	Laser
Wafer backgrinding:	Available
Lead inspection:	Laser/Optical
Pack/ship options:	Bar code, dry pack

Test Services:

Contact Amkor Test Services for more details.

• Program generation / conversion
• Product engineering support
• Wafer sort
• 256 pin x 20 MHz test system available
• Burn-in
• -55 °C to +165 °C test available