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TEPBGA (Thermally Enhanced PBGA)
 Amkor's TEPBGA's feature a drop-in heat spreader and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors (silicon). Amkor's PBGAs are designed for low inductance, improved thermal operation and enhanced SMT-ability. Custom performance enhancements, such as ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics. Additionally, these PBGAs utilize industry proven, semiconductor grade materials for reliable, long-term operation.
Applications:
Semiconductor technologies find enhanced performance by using the integrated design features of Amkor’s PBGAs. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets find Amkor’s PBGA family to be an ideal package. Applications requiring improved portability, form-factor / size and high-performance such as cellular, wireless, PCMCIA cards, laptop PC’s, video cameras, disc drives, PLDs, graphics and other similar products benefit from Amkor’s PBGA attributes.
Features:
Innovative designs and expanding package offerings provide a platform from prototype-to-production.
- Open tool and custom ball counts up to 1521
- 13 mm to 40 mm body sizes
- Optimized package structure which maximizes IC power dissipation
- 4-Layer substrate construction
- Internal copper plane thickness increased from 36µm to 72µm for improved heat transfer to the perimeter balls
- Thermal vias and thermal balls are added to improve heat conduction to the printed circuit board
- 1.0, 1.27 & 1.5 mm ball pitch available
- Perimeter, stagger and full ball arrays
- Special packaging for memory available
- Multi-layer, ground / power
- Full in-house design capability
- JEDEC MS-034 standard outlines
- Thermally Enhanced PCB
Thermal Resistance:
Multi layer PCB, 0 air flow
| Pkg |
Body Size |
PCB Layer |
Cu Thickness |
Theta JA (°C/W) |
| 356 |
27 x 27 |
4 |
72 µm |
14.6 |
| 452 |
35 x 35 |
4 |
72 µm |
11.8 |
Reliability:
Amkor assures you reliable performance by continuously monitoring key indices:
| Moisture sensitivity characterization: |
JEDEC Level 3, 30°C / 60% RH, 192 hours |
| High temp op life: |
125°C, 6V, 1000 hours |
| Autoclave or unbiased hast: |
130°C / 85% RH / 96 hours |
| High temp storage: |
150°C, 1000 hours |
| Temp cycle: |
-55°C / +125°C, 1000 cycles |
Process Highlights:
| Die Thickness (max): |
13 mils |
| Bond Pad Pitch (min): |
2.4 mils |
| Marking: |
Laser |
| Ball Inspection: |
Optical |
| Pack / Ship Options: |
Dry Pack |
| Wafer Backgrinding: |
Available |
Standard Materials:
| Package Substrate: |
CCL-HL832 |
| Die attach: |
Ablestik 2300 |
| Au wire: |
0.7 - 1mil wire |
| Mold compound: |
Plaskon SMT-B1RC |
| Solder balls: |
63 Sn / 37 Pb |
Test Services:
Contact Amkor Test Services for more details.
- Program generation / conversion
- Product engineering
- Wafer sort
- 256 Pin x 20 MHz Test System available
- -55°C to + 125°C Test available
- Tape and Reel Services
- Burn-in
Shipping:
- Low Profile Tray (JEDEC Outline CO-029)
Additional Information:
| Description |
File Type |
File Size |
| PBGA Data Sheet |
|
559 kb
|
For more information on the TEPBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
Thermally Enhanced BGA TEBGA
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