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Standard Outline Transistor (SOT-23)
Single Chip (SC-70)
 Amkor’s 1.0 mm thick, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, sub-miniature, SMT performance characteristics. These packages are high-density leadframe (HDLF) strip-assembled in densities up to 400 units per strip and are processed in an integrated line from die attach through tape and reel for maximum cost effectiveness.
Applications:
This Amkor exclusive technology provides a low-cost packaging solution particularly well suited for wireless / RF and analog devices, as well as ultra thin hand-held portable products such as cell phones, data storage systems, notebook computers and pagers.
Features:
Amkor’s SOT / SC packages offer:
- JEDEC and EIAJ compliant body sizes
- Available in 5, 6 and 8 lead for SOT23 and 6 lead for SC70
- 1.0 mm total package height
- Manufactured in high density leadframes for lowest cost
- 0.005" Copper leadframes for strength and thermal advantages
Reliability:
Amkor subjects their SOT / SC packages to high level testing to assure reliable performance.
| Moisture sensitivity characterization: |
JEDEC Level 1, 85 °C / 85%, 168 hrs, JEDEC Level 2, 85 °C / 85%, 168 hrs |
| PCT w/o precon: |
121 °C / 100%RH / 2 atm, 168 hrs |
| Un-biased HAST: |
130 °C / +85 °C, 96 hours |
| High temp storage: |
+175 °C, 500 hours |
| Temp cycle: |
-65 °C / +150 °C, 500 cycles |
Process Highlights:
| Die Thickness (max): |
8 mil |
| Bond Pad Pitch (min): |
=/> 3.1 mil |
| Marking: |
Laser |
| Lead Inspection: |
Optical |
| Pack / Ship Options: |
Tape & Reel or Bulk |
| Wafer Backgrinding: |
Available |
| Wafer Map: |
Capable |
| Solder Plate: |
85/15 Sn Pb or 100% Sn |
Green Material Standard:
| Leadframe Alloy: |
Copper (C194) |
| Die Attach Material: |
8290 |
| Gold Wire: |
0.8 mil diameter |
| Mold Compound: |
Sumitomo G600 |
| Lead Finish: |
100% Matte Tin |
Standard Materials with PB:
| Leadframe Alloy: |
Copper (C194) |
| Die Attach Material: |
84-1LMISR4 |
| Gold Wire: |
0.8 mil diameter |
| Mold Compound: |
NITTO 8000 CH4 |
| Lead Finish: |
85/15 solder (Sn/Pb) plate |
Test Services:
Contact Amkor Test Services for more details.
- Program generation / conversion
- Product engineering
- Wafer sort
- Ambient to +165 °C test available
- Tape and Reel Services
- Burn-in
Shipping:
- Aluminum Canister (40 x 95 mm)
- Tape and Reel
Configuration Options:
Additional Information:
| Description |
File Type |
File Size |
| SOT23 / SC70 Data Sheet |
 |
132 kb |
For more information on the SOT-23 / SC-70 package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
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