Amkor offers memory card assembly and test services in various formats; MMC, RS-MMC, MMCmicro, SD, mini-SD, MicroSD, xD Picture, Memory Stick, DUO, USB memory modules, etc. During the manufacturing process, Amkor provides assembly and test area security to assure product protection. Amkor's memory card assembly and test offering supports multiple chip-and-wire die and surface mount passive components in the same module and is designed for maximum customer flexibility. The memory card is constructed using conventional IC processing including wire bonding, molding and substrate infrastructure, which is then implanted into a plastic housing. The resulting package is MMCA and / or SDA specification compliant, which is one of the industry standards for compact removable storage media across multiple host platforms and markets.

There are many advantages as a direct result of the flexible chip-and-wire design. One key advantage is the ability to design customer specific substrates that optimize the MMC / SDC performance per specification.Amkor's patent pending AmKard^® fully-molded services support a 1x molded structure with substrates optimized for interconnection. The structure resulting from the AmKard^® fully-molded services provides superior mechanical strength.

All formats can be designed with the capability of stacking memory die within a single footprint on the same substrate. In this manner, increased memory density can be achieved without redesigning the substrate or leadframe. In addition, memory card services support surface mountable pre-packaged die. Thus, the die can be tested before surface mounting, resulting in known good units going into the memory card assembly.

Amkor’s fully molded (1x mold) AmKard^® services is the lowest cost memory card available. Amkor's AmKard^® services can be applied to most memory card formats.

Amkor has the protfolio of technologies to enable the most cost effective full turnkey memory card solution.

• Die stacking (in the memory card)
• Die packaging (including die stacking) that can be sold seperately, or be part of the memory solution
  • LF
  • Laminate
  • WLCSP
• Pre-packaged die testing
• Memory Card Assembly and Test

Applications:

Amkor's memory card technology is ideal for digital cameras, voice recorders, GPS navigation devices, bar code scanners, mobile phones, PDAs, MP3 players and other portable products where Flash Memory Cards are needed. In addition, these formats can be used for I/O applications such as Bluetooth^®, WLAN, bar scanners, accelerometers, etc.

Features:

Cutting edge technology and expanding package offerings provide a platform from prototype-to-production.

• Data and / or flash card supporting multiple die and SMT components (MMC / RS-MMC / SDC currently tooled)
• MMCA / SDCA compliant
• Conventional process flow with proven process technology
• Standardized footprint
• Die stacking
• Supports pre-packaged die
• Full turnkey support
• Memory and final card test
• Labeling
• Retail packing available
• Mechanical switch option (SDC)
• Die-to-die bonding

Amkor Memory Module Capabilities:

Design Substrate Card body and plastic housing Simulation	Material Handling Consigned materials Turnkey solution Drop shipping to final customer
Manufacturing Substrate IQA Complete solution from wafers to final modules Stacked die capability for higher module density Option for pre-packaged pre-tested flash die Mechanical assembly Packaging and labeling for final consumer package (bubble pack)	Test Design for testability support Test S/W and H/W development Test program transfer Wafer sort and final test capability for memory and ASIC products

Design and Simulation Capabilities:

Substrate Design

Amkor can work with the customer to layout the substrate, ensure all proper interconnects are made and the required test access points are designed in.

Substrate Simulation

• De-coupling capacitors
• Ground distribution
• Cross talk
• Overshoot, undershoot and ringing
• Calculate signal delays on address, data and control lines
• Optimize CLK trace

Electrical:

Co-designed to insure compliance to MMCA / SDCA electrical specifications.

Reliability:

Amkor assures a reliable performance by continuously monitoring key indices:

Test	Condition	Qualification
High temp storage:	85°C	500 hrs / 1000 hrs
Temp / humidity:	85°C / 85% RH	500 hrs / 1000 hrs
Temperature cycle:	-55°C to 85°C	40 / 100 / 500 cycles
Moisture / corrosion:	Mil ST 1009	24 hrs
Bend test:	20N MMC / 10N SD	5x / 10x
Twist test:	0.4 Nm MMC / 0.10 Nm SD	3x / 5x / 10x
Drop test:	1.5m free fall	6 faces
Durability:	40N @ 25mm / min	10,000 insertions
Salt water spray:	3% NaCl / 35°C	24 hrs / 48 hrs
WP Switch cycle (SD Only):	Slide force 0.4N to SN	1000 yards

Process Highlights:

Die thickness (std):	280 µm
Die attach adhesive:	Dispense
Wire bonding (std):	Au Thermosonic
Mold:	Transfer
Package marking:	Laser
Lid attach:	Adhesive or   Ultra sonic weld
Label attach:	Pressure sensitive

Standard Materials:

Substrate:	Thin core BT or equivalent   Copper (LF)
Solder:	Lead free
Die attach adhesive:	Conductive
Au wire:	25 µm diameter
Mold:	Standard EMC
Housing:	Plastic (If needed)

Test Services:

This package format allows for the integration of memory test as well as final card test (MMCA / SDCA protocol) to reduce test costs and cycle time.

Memory cards are shipped in clear vacuum-formed trays or retail bubble pack if final program content is performed.

Cross-section MMC:

Additional Information:

Description	File Type	File Size
Game, Memory, and I/O Cards (AmKard®) Data   Sheet		282 kb
Game, Memory, and I/O Cards (AmKard®) Data   Sheet (Japanese Translation)		212 kb
System in Package (SiP) Technology Solution   Data Sheet		92 kb

For more information on the MMC, Game, Memory, and I/O Cards (AmKard^®) packages, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.