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MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array)
 The MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array) by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA package provide the platform to mix semiconductor technologies such as analog, digital, bipolar, CMOS, ASIC, memory, etc., in a single IC package.
The affordability of our MCM-PBGAs enable systems designers to realize their vision of new, advanced or improved applications. Our designs are optimized to use standard PBGA package outline tooling to save you costs and utilize a proven BGA infrastructure. Additionally, we work with you to produce the most efficient substrate circuit design that will enhance the operation and performance of your IC chips. Our advanced in-house design center and electrical test support services complete the turn-key solution.
Applications:
Amkor’s MCM-PBGA is an excellent platform for reducing form factor and size while combining semiconductor technologies. MCM-PBGAs are perfect for any application where size, weight, electrical performance, board density and SMT yields are important considerations, such as ASICs, cable and DSL modems, wireless telecommunications and electronic automotive components.
Features:
Innovative designs and expanding package offerings provide a platform from prototype-to-production.
- Ball counts up to 1156
- 13 mm to 40 mm body sizes
- 1.00, 1.27 & 1.50 mm ball pitch available
- Perimeter, stagger and full ball arrays
- Special packaging for memory available
- 2, 4, or 6 layer construction, ground / power
- Full in-house design capability
- JEDEC MS-034 standard outlines
- MCM under high volume manufacturing in all sites
- Enhanced electrical performance, shorter signal paths and reduced package parasitics
- 2-8 Active devices
- 200-600 wire bonds
- Passives can be added by utilizing the SMT equipment located in the SiP line
Thermal Performance:
Multi layer PCB, 0 air flow
| Pkg |
Body Size |
PCB Layer |
Cu Thickness |
Theta JA (°C/W) |
| 272 |
27 x 27 |
4 |
36 µm |
19 |
| 388 |
35 x 35 |
4 |
36 µm |
16 |
Reliability:
Amkor assures you reliable performance by continuously monitoring key indices:
| Moisture sensitivity Characterization: |
JEDEC Level 3, 30 °C/60% RH, 192 hours |
| High temp op life: |
125 °C, 6V, 1000 hours |
| Autoclave or unbiased hast: |
130 °C/85% RH/96 hours |
| High temp storage: |
150 °C, 1000 hours |
| Temp cycle: |
-55 °C/+125 °C, 1000 cycles |
| Die Thickness (max): |
13 mils |
| Bond Pad Pitch (min): |
2.4 mils |
| Marking: |
Laser |
| Ball Inspection: |
Optical |
| Pack/Ship Options: |
Dry Pack |
| Wafer Backgrinding: |
Available |
Standard Materials:
| Package Substrate: |
CCL-HL832 |
| Die attach: |
Ablestik 2300 |
| Au wire: |
25 µm or 30 µm |
| Mold compound: |
Nitto GE 100L |
| Solder balls: |
63 Sn / 37 Pb |
Test Services:
- Program generation / conversion
- Product engineering
- Wafer sort
- 256 Pin x 20 mhz Test System available
- -55°C to + 125°C Test available
- Tape and Reel Services
- Burn-in
Shipping:
- Low Profile Tray (JEDEC Outline CO-029)
Cross Section Drawing:
For the MCM-PBGA Standard Package Offerings, please download the MCM-PBGA data sheet below.
Additional Information:
| Description |
File Type |
File Size |
| MCM-PBGA Data Sheet |
|
125 kb
|
| PBGA Data Sheet |
|
295 kb
|
For more information on the MCM-PBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
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