Amkor's HPBGA packages offer BGA technology in a deep cavity down architecture with multiple wire bonding tiers for power, ground and signals. Providing 6 to 12 metal layers with a copper heatspreader, this package has excellent thermal performance for high power applications and is ideal for 1 mm ball pitch packaging needs.

Applications:

This technology is especially applicable for your high-speed, high-power semiconductors, such as ASICs, Microprocessors, Graphic Chips, DSP and FPGA requiring high-performance packages. High Performance BGA technology fills the demand for speed, power and space requirements of Internet Routers, Switches, Communication Controllers, Network Servers, Wireless Base Stations, System on a Chip and other advanced end applications.

Features:

• 480 - 1036 ball count
• Custom packges in body sizes ranging from 35 x 35 mm to 47.5 x 47.5 mm
• 1.0 & 1.27 mm ball pitches available
• Superior Thermal Performance
• Ideal for 1 mm pitch
• Enhanced Electrical Performance > 1 GHz
• Excellent Reliability
• Cu Heat Spreader + 6 to 12 Metal layers allow multiple power / ground planes for Signals, VDD, and VSS
• Multi-tier cavity design
• Sealed with liquid encapsulant
• No encapsulation dam required - all bond tiers are within cavity
• Deep Cavity Down Architecture with Multiple Wire Bonding Tiers

Reliability:

Process Highlights and Standard Materials:

Biased Heatsink

Floating Heatsink

For more information on the HPBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.