This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard TSSOP packages. The ExposedPad^™ TSSOP can increase heat dissipation by as much as 150% over a standard TSSOP, thereby expanding the margin of operating parameters. Additionally, the ExposedPad can be connected to ground, thereby reducing loop inductance for high frequency applications. The exposed pad should be soldered directly to the PCB to realize the thermal and electrical benefits.

Applications:

Increased end-application densities and shrinking product sizes demand more from IC packages. ExposedPad^™ TSSOPs give designers the needed margin for designing and producing high performing products such as telecom, disk drives, pagers, wireless, CATV / RF modules, radio, aerospace, automotive/industrial and other similar applications including Bluetooth^®. GaAs, SiGe and hi-speed silicon technologies work especially well in PowerSOP^® packages due to added shielding and grounding capabilities.

Features:

Exceptional performance through the innovative design of ExposedPad TSSOPs offer:

• Solder plated exposed metal die pad
• Up to 60% improvement in Theta JA (compared to a standard TSSOP)
• 8 to 80 lead counts
• JEDEC package outline standard
• Highly conductive copper leadframe
• All leads electrically active
• 3.0 - 6.1 mil body sizes
• 0.9 mm body thickness for 4.4 & 6.1 mm body
• 0.85 mm body thickness for 3.0 mm body
• ExposedPad™ is easily inverted for heat sink attach
• Ground bonds to the die attach paddle are possible
• Low Profile - < 1.2 mm max mounted height
• Electrical - Very low loop inductance with use of paddle as ground path, more pins available for signal and allows for operating frquencies of up to 2.4 GHz

Reliability:

IC chips are assembled in optimized package designs with proven reliable semiconductor materials.

Moisture sensitivity characterization:	JEDEC Level 3,  30°C / 60% RH, 192 hrs
PCT:	121°C/100% RH/ 2 atm, 504 hrs
High temp storage:	150 °C, 1000 hrs.
Temp/Humidity:	85 °C/85% RH, 1000 hours
Temp cycle:	-65/150 °C, 1000 cycles

Process Highlights:

Die thickness (max):	11± 0.5 mils
Bond Pad Pitch:	0.10 mm
Solder plating:	85/15 Sn/Pb
Marking:	Laser
Wire Diameter:	1.0 mil
Pack / ship options:	Bar code, dry pack
Coplanarity (max):	3 mils

Test Services:

• Program generation / conversion
• Product engineering support
• Wafer sort
• Burn-in
• Tape and reel services
• Ambient to +165 °C test available
• 256 pin x 20 MHz test system available

For more information on the ePad^™ TSSOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.